3D Printed electronics: Opportunities and challenges from case studies

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

Original language	Undefined
Title of host publication	Proceedings of the ASME Design Engineering Technical Conference
DOIs	https://doi.org/10.1115/DETC2017-67503
Publication status	Published - 2017

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@inproceedings{4a87477fc886409ea8de55820391f368,

title = "3D Printed electronics: Opportunities and challenges from case studies",

author = "Y. Song and R.A. Boekraad and L. Roussos and A. Kooijman and C.C.L. Wang and J.M.P. Geraedts",

year = "2017",

doi = "10.1115/DETC2017-67503",

language = "Undefined",

booktitle = "Proceedings of the ASME Design Engineering Technical Conference",

}

TY - GEN

T1 - 3D Printed electronics: Opportunities and challenges from case studies

AU - Song, Y.

AU - Boekraad, R.A.

AU - Roussos, L.

AU - Kooijman, A.

AU - Wang, C.C.L.

AU - Geraedts, J.M.P.

PY - 2017

Y1 - 2017

UR - https://www.scopus.com/pages/publications/85034737199

U2 - 10.1115/DETC2017-67503

DO - 10.1115/DETC2017-67503

M3 - Conference contribution

BT - Proceedings of the ASME Design Engineering Technical Conference

ER -