A novel framework for exploring 3-D FPGAs with heterogeneous interconnect fabric

Kostas Siozios, Vasilis F. Pavlidis, Dimitrios Soudris

    Research output: Contribution to journalArticlepeer-review


    A heterogeneous interconnect architecture can be a useful approach for the design of 3-D FPGAs. A methodology to investigate heterogeneous interconnection schemes for 3-D FPGAs under different 3-D fabrication technologies is proposed. Application of the proposed methodology on benchmark circuits demonstrates an improvement in delay, power consumption, and total wire-length of approximately 41%, 32%, and 36%, respectively, as compared to 2-D FPGAs. These improvements are additional to reducing the number of interlayer connections. The fewer interlayer connections are traded off for a higher yield. An area model to evaluate this trade-off is presented. Results indicate that a heterogeneous 3-D FPGA requires 37% less area as compared to a homogeneous 3-D FPGA. Consequently, the heterogeneous FPGAs can exhibit a higher manufacturing yield. A design toolset is also developed to support the design and exploration of various performance metrics for the proposed 3-D FPGAs. © 2012 ACM.
    Original languageEnglish
    JournalACM Transactions on Reconfigurable Technology and Systems
    Issue number1
    Publication statusPublished - Mar 2012


    • 3-D integration
    • 3-D reconfigurable architectures
    • Design framework
    • FPGAs
    • Interconnection fabric


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