Abstract
Multiple material additive manufacturing technology with the capability to integrate glass-ceramic and metallic materials is essential to the development of high-performance functional components for high temperature applications. Here we show the feasibility and characteristics of additively manufactured glass-ceramic/metal 3D electronic components via single-process multiple material laser powder bed fusion (MMLPBF). Copper (II) oxide (CuO) powder is mixed with α-spodumene (lithium aluminosilicate, Li2O·Al2O3·4SiO2) glass-ceramic powder to improve the laser absorbance, reduce the melting point of glass-ceramic to match that of copper and to improve bonding between copper and the glass-ceramic. Up to 92 % relative density of the glass-ceramic is realized. The monoclinic crystal α-spodumene has been transformed to tetragonal crystal β-spodumene after laser melting. Sodium chloride (NaCl) and graphite mixed powder is printed as the substrate for the glass-ceramic component for its rapid removal. Embedded conductive Copper wires and plates as the main conductive structures are successfully built within the glass-ceramic from powder feedstocks. The electrical resistivity of the printed Copper structures is examined. An embedded multiple layer electric circuit, a capacitor and a temperature sensor are successfully printed and tested.
Original language | English |
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Article number | 102481 |
Number of pages | 13 |
Journal | Additive Manufacturing |
Volume | 49 |
DOIs | |
Publication status | Published - 14 Nov 2021 |
Keywords
- Additive manufacturing; Laser powder bed fusion; Multiple material; Glass-ceramic; High temperature; Circuit; Capacitor; Temperature sensor