Original language | English |
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Title of host publication | Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th |
Pages | 320-324 |
Number of pages | 5 |
Publication status | Published - 2016 |
Analysis of moisture transport between connected enclosures under a forced thermal gradient
Z Staliulionis, S Joshy, R Ambat, M Jabbari, S Mohanty, JH Hattel
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review