Analysis of moisture transport between connected enclosures under a forced thermal gradient

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th
Pages	320-324
Number of pages	5
Publication status	Published - 2016

Cite this

@inproceedings{892c85d18c2c42729c74a7b36d85d330,

title = "Analysis of moisture transport between connected enclosures under a forced thermal gradient",

author = "Z Staliulionis and S Joshy and R Ambat and M Jabbari and S Mohanty and JH Hattel",

year = "2016",

language = "English",

pages = "320--324",

booktitle = "Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th",

}