Anodic film growth on Al-Li-Cu alloy AA2099-T8

Y. Ma; X. Zhou; G. E. Thompson; M. Curioni; P. Skeldon; X. Zhang; Z. Sun; C. Luo; Z. Tang; F. Lu

doi:10.1016/j.electacta.2012.06.126

Anodic film growth on Al-Li-Cu alloy AA2099-T8

Y. Ma, X. Zhou, G. E. Thompson, M. Curioni, P. Skeldon, X. Zhang, Z. Sun, C. Luo, Z. Tang, F. Lu

Research output: Contribution to journal › Article › peer-review

Abstract

AA2099-T8 aluminium alloy was anodized at a current density of 5 mA/cm 2 to selected voltages in 0.1 M ammonium pentaborate electrolyte at 293 K. It was found that the growth of barrier-type anodic film on the alloy was accompanied by oxidation of intermetallics, formation and rupture of oxygen gas-filled voids in the anodic film and healing of the anodic film at the sites of rupture. It was revealed that the formation of oxygen gas-filled voids was related to the oxidation of copper-rich nanoparticles in the copper-enriched layer at the film/alloy interface, and that the oxidation process of copper-rich nanoparticles depended on grain orientation. Further, the significantly reduced Pilling-Bedworth ratio for formation of anodic lithium oxide compared with that for formation of anodic alumina resulted in the formation of fine voids at the alloy/film interface and sequentially, detachment of the anodic film from the alloy surface. © 2012 Elsevier Ltd.

Original language	English
Pages (from-to)	148-159
Number of pages	11
Journal	Electrochimica Acta
Volume	80
DOIs	https://doi.org/10.1016/j.electacta.2012.06.126
Publication status	Published - 1 Oct 2012

Keywords

Aluminum alloy
Anodizing
Film detachment
Grain orientation
Lithium

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10.1016/j.electacta.2012.06.126

Light Alloys towards environmentally sustainable transport: 2nd generation solutions for Advanced Metallic Systems ( LATEST 2 )
Thompson, G. (PI), Bate, P. (CoI), Prangnell, P. (CoI), Preuss, M. (CoI), Quinta Da Fonseca, J. (CoI), Robson, J. (CoI), Skeldon, P. (CoI) & Zhou, X. (CoI)
1/02/10 → 31/07/15
Project: Research

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@article{9ae22f4eb34d46f3ad6b40b441c875b1,

title = "Anodic film growth on Al-Li-Cu alloy AA2099-T8",

abstract = "AA2099-T8 aluminium alloy was anodized at a current density of 5 mA/cm 2 to selected voltages in 0.1 M ammonium pentaborate electrolyte at 293 K. It was found that the growth of barrier-type anodic film on the alloy was accompanied by oxidation of intermetallics, formation and rupture of oxygen gas-filled voids in the anodic film and healing of the anodic film at the sites of rupture. It was revealed that the formation of oxygen gas-filled voids was related to the oxidation of copper-rich nanoparticles in the copper-enriched layer at the film/alloy interface, and that the oxidation process of copper-rich nanoparticles depended on grain orientation. Further, the significantly reduced Pilling-Bedworth ratio for formation of anodic lithium oxide compared with that for formation of anodic alumina resulted in the formation of fine voids at the alloy/film interface and sequentially, detachment of the anodic film from the alloy surface. {\textcopyright} 2012 Elsevier Ltd.",

keywords = "Aluminum alloy, Anodizing, Film detachment, Grain orientation, Lithium",

author = "Y. Ma and X. Zhou and Thompson, {G. E.} and M. Curioni and P. Skeldon and X. Zhang and Z. Sun and C. Luo and Z. Tang and F. Lu",

year = "2012",

month = oct,

day = "1",

doi = "10.1016/j.electacta.2012.06.126",

language = "English",

volume = "80",

pages = "148--159",

journal = "Electrochimica Acta",

publisher = "Elsevier BV",

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TY - JOUR

T1 - Anodic film growth on Al-Li-Cu alloy AA2099-T8

AU - Ma, Y.

AU - Zhou, X.

AU - Thompson, G. E.

AU - Curioni, M.

AU - Skeldon, P.

AU - Zhang, X.

AU - Sun, Z.

AU - Luo, C.

AU - Tang, Z.

AU - Lu, F.

PY - 2012/10/1

Y1 - 2012/10/1

N2 - AA2099-T8 aluminium alloy was anodized at a current density of 5 mA/cm 2 to selected voltages in 0.1 M ammonium pentaborate electrolyte at 293 K. It was found that the growth of barrier-type anodic film on the alloy was accompanied by oxidation of intermetallics, formation and rupture of oxygen gas-filled voids in the anodic film and healing of the anodic film at the sites of rupture. It was revealed that the formation of oxygen gas-filled voids was related to the oxidation of copper-rich nanoparticles in the copper-enriched layer at the film/alloy interface, and that the oxidation process of copper-rich nanoparticles depended on grain orientation. Further, the significantly reduced Pilling-Bedworth ratio for formation of anodic lithium oxide compared with that for formation of anodic alumina resulted in the formation of fine voids at the alloy/film interface and sequentially, detachment of the anodic film from the alloy surface. © 2012 Elsevier Ltd.

AB - AA2099-T8 aluminium alloy was anodized at a current density of 5 mA/cm 2 to selected voltages in 0.1 M ammonium pentaborate electrolyte at 293 K. It was found that the growth of barrier-type anodic film on the alloy was accompanied by oxidation of intermetallics, formation and rupture of oxygen gas-filled voids in the anodic film and healing of the anodic film at the sites of rupture. It was revealed that the formation of oxygen gas-filled voids was related to the oxidation of copper-rich nanoparticles in the copper-enriched layer at the film/alloy interface, and that the oxidation process of copper-rich nanoparticles depended on grain orientation. Further, the significantly reduced Pilling-Bedworth ratio for formation of anodic lithium oxide compared with that for formation of anodic alumina resulted in the formation of fine voids at the alloy/film interface and sequentially, detachment of the anodic film from the alloy surface. © 2012 Elsevier Ltd.

KW - Aluminum alloy

KW - Anodizing

KW - Film detachment

KW - Grain orientation

KW - Lithium

U2 - 10.1016/j.electacta.2012.06.126

DO - 10.1016/j.electacta.2012.06.126

M3 - Article

VL - 80

SP - 148

EP - 159

JO - Electrochimica Acta

JF - Electrochimica Acta

ER -

Anodic film growth on Al-Li-Cu alloy AA2099-T8

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Keywords

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Projects

Light Alloys towards environmentally sustainable transport: 2nd generation solutions for Advanced Metallic Systems ( LATEST 2 )

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