Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte

M. S. Palagonia; Aneta Nemcova; I. Kuběna; M. Šmíd; S. Gao; H. Liu; X. L. Zhong; S. J. Haigh; M. Santamaria; F. Di Quarto; H. Habazaki; P. Skeldon; G. E. Thompson

doi:10.1149/2.0761509jes

Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte

M. S. Palagonia, Aneta Nemcova, I. Kuběna, M. Šmíd, S. Gao, H. Liu, X. L. Zhong, S. J. Haigh, M. Santamaria, F. Di Quarto, H. Habazaki, P. Skeldon, G. E. Thompson

Research output: Contribution to journal › Article › peer-review

Abstract

Anodizing of sputtering-deposited magnesium and Mg-0.75at.%Cu and Mg-1.23at.%W alloys has been carried out in a fluoride/ glycerol electrolyte. The aims of the study were to investigate the enrichment of alloying elements in the alloy immediately beneath the anodic film and the migration of alloying element species in the film. The specimens were examined by electron microscopy and ion beam analysis. An enrichment of copper is revealed in the Mg-Cu alloy that increases with the anodizing time up to ∼6×10¹⁵ Cu atoms cm^-2. Copper species are then incorporated into the anodic film and migrate outwards. In contrast, no enrichment of tungsten occurs in the Mg-W alloy, and tungsten species are immobile in the film.

Original language	English
Pages (from-to)	C487-C494
Journal	Electrochemical Society. Journal
Volume	162
Issue number	9
DOIs	https://doi.org/10.1149/2.0761509jes https://doi.org/10.1149/2.0761509jes
Publication status	Published - 30 Jun 2015

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Palagonia, M. S., Nemcova, A., Kuběna, I., Šmíd, M., Gao, S., Liu, H., Zhong, X. L., Haigh, S. J., Santamaria, M., Di Quarto, F., Habazaki, H., Skeldon, P., & Thompson, G. E. (2015). Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte. Electrochemical Society. Journal, 162(9), C487-C494. https://doi.org/10.1149/2.0761509jes, https://doi.org/10.1149/2.0761509jes

@article{69202c8352c24545a816bd18453459e2,

title = "Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte",

abstract = "Anodizing of sputtering-deposited magnesium and Mg-0.75at.%Cu and Mg-1.23at.%W alloys has been carried out in a fluoride/ glycerol electrolyte. The aims of the study were to investigate the enrichment of alloying elements in the alloy immediately beneath the anodic film and the migration of alloying element species in the film. The specimens were examined by electron microscopy and ion beam analysis. An enrichment of copper is revealed in the Mg-Cu alloy that increases with the anodizing time up to ∼6×1015 Cu atoms cm-2. Copper species are then incorporated into the anodic film and migrate outwards. In contrast, no enrichment of tungsten occurs in the Mg-W alloy, and tungsten species are immobile in the film.",

author = "Palagonia, {M. S.} and Aneta Nemcova and I. Kub{\v e}na and M. {\v S}m{\'i}d and S. Gao and H. Liu and Zhong, {X. L.} and Haigh, {S. J.} and M. Santamaria and {Di Quarto}, F. and H. Habazaki and P. Skeldon and Thompson, {G. E.}",

year = "2015",

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doi = "10.1149/2.0761509jes",

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Palagonia, MS, Nemcova, A, Kuběna, I, Šmíd, M, Gao, S, Liu, H, Zhong, XL , Haigh, SJ, Santamaria, M, Di Quarto, F, Habazaki, H, Skeldon, P & Thompson, GE 2015, 'Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte', Electrochemical Society. Journal, vol. 162, no. 9, pp. C487-C494. https://doi.org/10.1149/2.0761509jes, https://doi.org/10.1149/2.0761509jes

TY - JOUR

T1 - Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte

AU - Palagonia, M. S.

AU - Nemcova, Aneta

AU - Kuběna, I.

AU - Šmíd, M.

AU - Gao, S.

AU - Liu, H.

AU - Zhong, X. L.

AU - Haigh, S. J.

AU - Santamaria, M.

AU - Di Quarto, F.

AU - Habazaki, H.

AU - Skeldon, P.

AU - Thompson, G. E.

PY - 2015/6/30

Y1 - 2015/6/30

N2 - Anodizing of sputtering-deposited magnesium and Mg-0.75at.%Cu and Mg-1.23at.%W alloys has been carried out in a fluoride/ glycerol electrolyte. The aims of the study were to investigate the enrichment of alloying elements in the alloy immediately beneath the anodic film and the migration of alloying element species in the film. The specimens were examined by electron microscopy and ion beam analysis. An enrichment of copper is revealed in the Mg-Cu alloy that increases with the anodizing time up to ∼6×1015 Cu atoms cm-2. Copper species are then incorporated into the anodic film and migrate outwards. In contrast, no enrichment of tungsten occurs in the Mg-W alloy, and tungsten species are immobile in the film.

AB - Anodizing of sputtering-deposited magnesium and Mg-0.75at.%Cu and Mg-1.23at.%W alloys has been carried out in a fluoride/ glycerol electrolyte. The aims of the study were to investigate the enrichment of alloying elements in the alloy immediately beneath the anodic film and the migration of alloying element species in the film. The specimens were examined by electron microscopy and ion beam analysis. An enrichment of copper is revealed in the Mg-Cu alloy that increases with the anodizing time up to ∼6×1015 Cu atoms cm-2. Copper species are then incorporated into the anodic film and migrate outwards. In contrast, no enrichment of tungsten occurs in the Mg-W alloy, and tungsten species are immobile in the film.

UR - http://www.scopus.com/inward/record.url?scp=84937046197&partnerID=8YFLogxK

U2 - 10.1149/2.0761509jes

DO - 10.1149/2.0761509jes

M3 - Article

SN - 0013-4651

VL - 162

SP - C487-C494

JO - Electrochemical Society. Journal

JF - Electrochemical Society. Journal

IS - 9

ER -

Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolyte

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