CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces

Y.Z. Yan; L. Li; T.L. See; L.F. Ji; Y.J. Jiang

doi:10.1016/j.jeurceramsoc.2013.01.023

CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces

Y.Z. Yan, L. Li, T.L. See, L.F. Ji, Y.J. Jiang

Mechanical and Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

A laser controlled fracture peeling technique is demonstrated to smooth the Al2O3 ceramic surface without thermal damages. It was found that a chip can be separated and curled from the ceramic surface during a focused CO2 continuous wave (CW) laser dual-scanning. The thickness of the curled chip is similar to 50 mu m and the formed subsurface roughness (R-a approximate to 2 mu m) is close to the surface machined by mechanical breaking (R-a = 1.84 mu m). The chip formation is attributed to the controlled fracture by the residual tensile stress in the recast layer, whereas the chip curling only occurs when the melting depth is shallower than the position of lateral cracks. The peeling technique can be applied to polish the cut surface of laser fusion cutting in ceramics. The polished cut surface (R-a = 2.18 mu m) is free from recast, crack and heat effects. The microstructure is similar to the base material. The material removal rate during polishing is up to 0.125 mm(3)/s. (C) 2013 Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	1893-1905
Number of pages	12
Journal	European Ceramic Society. Journal
Volume	33
Issue number	10
DOIs	https://doi.org/10.1016/j.jeurceramsoc.2013.01.023
Publication status	Published - Sept 2013

Keywords

Controlled fracture; Peeling; Polishing; Alumina; Finite element modelling; FRACTURE MACHINING TECHNIQUE; ALUMINA; CRACKLESS; THICK; GLASS

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10.1016/j.jeurceramsoc.2013.01.023

LPRC: Laser Processing Research Centre Impact
Allegre, O. (PI), Crosby, D. (PI), Domingos, M. (PI), Francis, J. (PI), Gillen, D. (PI), Guo, W. (PI), Li, L. (PI), Mativenga, P. (PI), Rogers, B. D. (PI), Whitehead, D. (PI), Wilson, D. (PI), Zhong, S. (PI), Mirhosseini, N. (Researcher), Ouyang, J. (Researcher), Huang, Y. (Researcher), Wei, C. (Researcher), Cheng, D. (PGR student), Suryo Pratomo, E. (PGR student), Zhang, Z. (PGR student), Li, Z. (PGR student), Mo, H. (PGR student), Zhu, M. (PGR student), Li, Q. (PGR student), Liu, W. (PGR student), Wang, L. (PGR student), Guo, H. (PGR student), Heinemann, R. (PI) & Liu, Z. (PI)
1/04/00 → …
Project: Research

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title = "CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces",

abstract = "A laser controlled fracture peeling technique is demonstrated to smooth the Al2O3 ceramic surface without thermal damages. It was found that a chip can be separated and curled from the ceramic surface during a focused CO2 continuous wave (CW) laser dual-scanning. The thickness of the curled chip is similar to 50 mu m and the formed subsurface roughness (R-a approximate to 2 mu m) is close to the surface machined by mechanical breaking (R-a = 1.84 mu m). The chip formation is attributed to the controlled fracture by the residual tensile stress in the recast layer, whereas the chip curling only occurs when the melting depth is shallower than the position of lateral cracks. The peeling technique can be applied to polish the cut surface of laser fusion cutting in ceramics. The polished cut surface (R-a = 2.18 mu m) is free from recast, crack and heat effects. The microstructure is similar to the base material. The material removal rate during polishing is up to 0.125 mm(3)/s. (C) 2013 Elsevier Ltd. All rights reserved.",

keywords = "Controlled fracture; Peeling; Polishing; Alumina; Finite element modelling; FRACTURE MACHINING TECHNIQUE; ALUMINA; CRACKLESS; THICK; GLASS",

author = "Y.Z. Yan and L. Li and T.L. See and L.F. Ji and Y.J. Jiang",

year = "2013",

month = sep,

doi = "10.1016/j.jeurceramsoc.2013.01.023",

language = "English",

volume = "33",

pages = "1893--1905",

journal = "European Ceramic Society. Journal",

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T1 - CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces

AU - Yan, Y.Z.

AU - Li, L.

AU - See, T.L.

AU - Ji, L.F.

AU - Jiang, Y.J.

PY - 2013/9

Y1 - 2013/9

N2 - A laser controlled fracture peeling technique is demonstrated to smooth the Al2O3 ceramic surface without thermal damages. It was found that a chip can be separated and curled from the ceramic surface during a focused CO2 continuous wave (CW) laser dual-scanning. The thickness of the curled chip is similar to 50 mu m and the formed subsurface roughness (R-a approximate to 2 mu m) is close to the surface machined by mechanical breaking (R-a = 1.84 mu m). The chip formation is attributed to the controlled fracture by the residual tensile stress in the recast layer, whereas the chip curling only occurs when the melting depth is shallower than the position of lateral cracks. The peeling technique can be applied to polish the cut surface of laser fusion cutting in ceramics. The polished cut surface (R-a = 2.18 mu m) is free from recast, crack and heat effects. The microstructure is similar to the base material. The material removal rate during polishing is up to 0.125 mm(3)/s. (C) 2013 Elsevier Ltd. All rights reserved.

AB - A laser controlled fracture peeling technique is demonstrated to smooth the Al2O3 ceramic surface without thermal damages. It was found that a chip can be separated and curled from the ceramic surface during a focused CO2 continuous wave (CW) laser dual-scanning. The thickness of the curled chip is similar to 50 mu m and the formed subsurface roughness (R-a approximate to 2 mu m) is close to the surface machined by mechanical breaking (R-a = 1.84 mu m). The chip formation is attributed to the controlled fracture by the residual tensile stress in the recast layer, whereas the chip curling only occurs when the melting depth is shallower than the position of lateral cracks. The peeling technique can be applied to polish the cut surface of laser fusion cutting in ceramics. The polished cut surface (R-a = 2.18 mu m) is free from recast, crack and heat effects. The microstructure is similar to the base material. The material removal rate during polishing is up to 0.125 mm(3)/s. (C) 2013 Elsevier Ltd. All rights reserved.

KW - Controlled fracture; Peeling; Polishing; Alumina; Finite element modelling; FRACTURE MACHINING TECHNIQUE; ALUMINA; CRACKLESS; THICK; GLASS

U2 - 10.1016/j.jeurceramsoc.2013.01.023

DO - 10.1016/j.jeurceramsoc.2013.01.023

M3 - Article

SN - 0955-2219

VL - 33

SP - 1893

EP - 1905

JO - European Ceramic Society. Journal

JF - European Ceramic Society. Journal

IS - 10

ER -

CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces

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Keywords

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LPRC: Laser Processing Research Centre Impact

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