Composite material for manufacturing electronic device and structural material, comprises substrate or matrix and filler containing filler material comprising several individual fragments having specified thickness

I Kinloch (Other), R Young (Other), L Gong (Other)

    Research output: Patent

    Abstract

    NOVELTY - A composite material comprises a substrate or matrix and a filler comprising of layered, inorganic two-dimensional material with in-plane modulus significantly higher than shear modulus between the layers. The filler material is dispersed within matrix or provided on substrate. The filler material comprises several individual fragments in which thickness of filler fragments is such that 50% or more of filler has thickness of between 2 layers and 7 layers, preferably 50 wt.% filler has required number of layers. USE - Composite material is used for manufacturing electronic device and structural material (all claimed). Uses include but are not limited to electronics and material application, field emitter device, strain sensor, electrodes, high-strength composites, storage structures of hydrogen, fuel cell, optical device and transducer. ADVANTAGE - The composite material has excellent strength, stiffness, density, crystallinity, thermal conductivity, electrical conductivity, absorption property, magnetic properties, absorption and luminescent property, heat conductivity, buffering capacity, and sensitivity to chemicals. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following:(1) preparation of composite, which involves providing several individual filler fragments, providing substrate, depositing filler fragments onto the substrate, admixing filler fragments with matrix-forming material to produce dispersion of filler in the matrix and optionally curing the matrix forming material. Filler fragments are not chemically treated before deposition on the polymer substrate;(2) material, which comprises several individual graphene fragments as filler. The graphene has average thickness of between 2 graphene layers and 7 graphene layers. The thickness of individual graphene fragments is such that at least 50% of the graphene has thickness between 2 layers and 7 layers; and(3) usage of filler for improving one or more mechanical properties chosen from strength, modulus, wear resistance and hardness of matrix or substrate, which involves incorporating filler into matrix and/or applying filler onto the substrate to form composite material.
    Original languageEnglish
    Patent numberWO2013114116-A1; CA2863296-A1; AU2013213957-A1; KR2014129071-A; EP2809714-A1; US2014370269-A1; CN104204056-A; JP2015513565-W; IN201401662-P3
    Publication statusPublished - 2011

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