Abstract
A heterogeneous contactless transceiver circuit is
designed to provide half duplex communication for a 3-D system
considering specific bonding constraints. The system is composed
of two tiers and is integrated face-to-back to support fluidic
sensing. Communication between the tiers is achieved through
inductive links. Each tier is considered to be fabricated in a different
technology node to enable low manufacturing cost and benefit
from the advantages each technology offers. Both the uplink
and downlink transceivers achieve data rates that reach 1 Gbps
with non-return-to-zero data encoding. Energy efficiency is the
predominant objective, with the uplink dissipating 4:93 mW and
the downlink 10:53 mW. A 5:2x power reduction is achieved
when using heterogeneous technologies, compared to a state-of-
the-art 0:35 μm transceiver, while the dissipated energy is
decreased by 34% as compared to a state-of-the-art 65 nm
transceiver.
designed to provide half duplex communication for a 3-D system
considering specific bonding constraints. The system is composed
of two tiers and is integrated face-to-back to support fluidic
sensing. Communication between the tiers is achieved through
inductive links. Each tier is considered to be fabricated in a different
technology node to enable low manufacturing cost and benefit
from the advantages each technology offers. Both the uplink
and downlink transceivers achieve data rates that reach 1 Gbps
with non-return-to-zero data encoding. Energy efficiency is the
predominant objective, with the uplink dissipating 4:93 mW and
the downlink 10:53 mW. A 5:2x power reduction is achieved
when using heterogeneous technologies, compared to a state-of-
the-art 0:35 μm transceiver, while the dissipated energy is
decreased by 34% as compared to a state-of-the-art 65 nm
transceiver.
| Original language | English |
|---|---|
| Title of host publication | International Symposium on Circuits and Systems |
| Number of pages | 4 |
| DOIs | |
| Publication status | Accepted/In press - 20 Feb 2017 |
| Event | IEEE International Symposium on Circuits and Systems: From Dreams to Innovation - Baltimore, United States Duration: 28 May 2017 → 31 May 2017 http://iscas2017.org/ |
Conference
| Conference | IEEE International Symposium on Circuits and Systems |
|---|---|
| Abbreviated title | ISCAS 2017 |
| Country/Territory | United States |
| City | Baltimore |
| Period | 28/05/17 → 31/05/17 |
| Internet address |
