Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

Vasileios Pavlidis, Ioannis Papistas

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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    A heterogeneous contactless transceiver circuit is
    designed to provide half duplex communication for a 3-D system
    considering specific bonding constraints. The system is composed
    of two tiers and is integrated face-to-back to support fluidic
    sensing. Communication between the tiers is achieved through
    inductive links. Each tier is considered to be fabricated in a different
    technology node to enable low manufacturing cost and benefit
    from the advantages each technology offers. Both the uplink
    and downlink transceivers achieve data rates that reach 1 Gbps
    with non-return-to-zero data encoding. Energy efficiency is the
    predominant objective, with the uplink dissipating 4:93 mW and
    the downlink 10:53 mW. A 5:2x power reduction is achieved
    when using heterogeneous technologies, compared to a state-of-
    the-art 0:35 μm transceiver, while the dissipated energy is
    decreased by 34% as compared to a state-of-the-art 65 nm
    Original languageEnglish
    Title of host publicationInternational Symposium on Circuits and Systems
    Number of pages4
    Publication statusAccepted/In press - 20 Feb 2017
    EventIEEE International Symposium on Circuits and Systems: From Dreams to Innovation - Baltimore, United States
    Duration: 28 May 201731 May 2017


    ConferenceIEEE International Symposium on Circuits and Systems
    Abbreviated titleISCAS 2017
    Country/TerritoryUnited States
    Internet address


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