Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

Vasileios Pavlidis; Ioannis Papistas

doi:10.1109/ISCAS.2017.8050946

Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

Vasileios Pavlidis
, Ioannis Papistas

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

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Abstract

A heterogeneous contactless transceiver circuit is
designed to provide half duplex communication for a 3-D system
considering specific bonding constraints. The system is composed
of two tiers and is integrated face-to-back to support fluidic
sensing. Communication between the tiers is achieved through
inductive links. Each tier is considered to be fabricated in a different
technology node to enable low manufacturing cost and benefit
from the advantages each technology offers. Both the uplink
and downlink transceivers achieve data rates that reach 1 Gbps
with non-return-to-zero data encoding. Energy efficiency is the
predominant objective, with the uplink dissipating 4:93 mW and
the downlink 10:53 mW. A 5:2x power reduction is achieved
when using heterogeneous technologies, compared to a state-of-
the-art 0:35 μm transceiver, while the dissipated energy is
decreased by 34% as compared to a state-of-the-art 65 nm
transceiver.

Original language	English
Title of host publication	International Symposium on Circuits and Systems
Number of pages	4
DOIs	https://doi.org/10.1109/ISCAS.2017.8050946
Publication status	Accepted/In press - 20 Feb 2017
Event	IEEE International Symposium on Circuits and Systems: From Dreams to Innovation - Baltimore, United States Duration: 28 May 2017 → 31 May 2017 http://iscas2017.org/

Conference

Conference	IEEE International Symposium on Circuits and Systems
Abbreviated title	ISCAS 2017
Country/Territory	United States
City	Baltimore
Period	28/05/17 → 31/05/17
Internet address	http://iscas2017.org/

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy
SDG 9 Industry, Innovation, and Infrastructure

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10.1109/ISCAS.2017.8050946

iscas17_20170313_cameraReadyAccepted author manuscript, 224 KB

Cite this

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title = "Contactless Inter-Tier Communication for Heterogeneous 3-D ICs",

abstract = "A heterogeneous contactless transceiver circuit is designed to provide half duplex communication for a 3-D system considering specific bonding constraints. The system is composed of two tiers and is integrated face-to-back to support fluidic sensing. Communication between the tiers is achieved through inductive links. Each tier is considered to be fabricated in a different technology node to enable low manufacturing cost and benefit from the advantages each technology offers. Both the uplink and downlink transceivers achieve data rates that reach 1 Gbps with non-return-to-zero data encoding. Energy efficiency is the predominant objective, with the uplink dissipating 4:93 mW and the downlink 10:53 mW. A 5:2x power reduction is achieved when using heterogeneous technologies, compared to a state-of- the-art 0:35 μm transceiver, while the dissipated energy is decreased by 34\% as compared to a state-of-the-art 65 nm transceiver.",

author = "Vasileios Pavlidis and Ioannis Papistas",

year = "2017",

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day = "20",

doi = "10.1109/ISCAS.2017.8050946",

language = "English",

booktitle = "International Symposium on Circuits and Systems",

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TY - GEN

T1 - Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

AU - Pavlidis, Vasileios

AU - Papistas, Ioannis

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Y1 - 2017/2/20

N2 - A heterogeneous contactless transceiver circuit is designed to provide half duplex communication for a 3-D system considering specific bonding constraints. The system is composed of two tiers and is integrated face-to-back to support fluidic sensing. Communication between the tiers is achieved through inductive links. Each tier is considered to be fabricated in a different technology node to enable low manufacturing cost and benefit from the advantages each technology offers. Both the uplink and downlink transceivers achieve data rates that reach 1 Gbps with non-return-to-zero data encoding. Energy efficiency is the predominant objective, with the uplink dissipating 4:93 mW and the downlink 10:53 mW. A 5:2x power reduction is achieved when using heterogeneous technologies, compared to a state-of- the-art 0:35 μm transceiver, while the dissipated energy is decreased by 34% as compared to a state-of-the-art 65 nm transceiver.

AB - A heterogeneous contactless transceiver circuit is designed to provide half duplex communication for a 3-D system considering specific bonding constraints. The system is composed of two tiers and is integrated face-to-back to support fluidic sensing. Communication between the tiers is achieved through inductive links. Each tier is considered to be fabricated in a different technology node to enable low manufacturing cost and benefit from the advantages each technology offers. Both the uplink and downlink transceivers achieve data rates that reach 1 Gbps with non-return-to-zero data encoding. Energy efficiency is the predominant objective, with the uplink dissipating 4:93 mW and the downlink 10:53 mW. A 5:2x power reduction is achieved when using heterogeneous technologies, compared to a state-of- the-art 0:35 μm transceiver, while the dissipated energy is decreased by 34% as compared to a state-of-the-art 65 nm transceiver.

U2 - 10.1109/ISCAS.2017.8050946

DO - 10.1109/ISCAS.2017.8050946

M3 - Conference contribution

BT - International Symposium on Circuits and Systems

T2 - IEEE International Symposium on Circuits and Systems

Y2 - 28 May 2017 through 31 May 2017

ER -

Contactless Inter-Tier Communication for Heterogeneous 3-D ICs

Abstract

Conference

UN SDGs

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