Crosstalk noise effects of on-chip inductive links on power delivery networks

Inductive links have been proposed as an intertier interconnect solution for three-dimensional (3-D) integrated systems. Combined with signal multiplexing, inductive links achieve high communication bandwidth comparable to that of through silicon vias. However, being a wireless medium, electromagnetic c oupling between the inductive link and nearby on-chip interconnects can cause voltage fluctuations affecting interconnect performance. The interference of interconnects on the operation of inductive links has been empirically investigated. Nevertheless, the reverse problem has yet to be explored. Consequently, this paper investigates the effect of electromagnetic coupling on global interconnects of the power delivery network in the vicinity of on-chip inductors. Analysis shows that operation at 6 GHz leads to an induced noise of 39.5 mV per link, which increases further if the interconnect length spans several inductors. As this noise adds to the existing power supply noise, this paper proposes amendments to the placement of the power/ground lines to maintain the power supply noise below a specified limit.