Deactivation of B and BF2 profiles after non-melt laser annealing

James A. Sharp*, Nicholas E B Cowern, Roger P. Webb, Damiano Giubertoni, Salvotore Gennaro, Massimo Bersani, Majeed A. Foad, Karen J. Kirkby

*Corresponding author for this work

    Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

    Abstract

    Ultra-shallow B and BF 2 implants in silicon pre-amorphised with Ge have been activated using a scanning non-melt laser. The implants were activated either by using 1 or 10 laser scans. Isochronal 60s post-laser annealing between 700-1000°C were then undertaken to study the deactivation and reactivation of the B. Both B and BF2 samples were implanted with a dose of 1×10 15 B cm -2 at an effective energy of 500eV. The presence of F from the BF 2 implants, which is superimposed over the boron profile increases the sheet resistance of the initial fabricated junction (from 600-700 ohms/sq from B implants only to 750-1100 ohms/sq for BF2 implants). Fluorine also changes the deactivation and reactivation behaviour of the boron during the post-anneals by increasing the amount of deactivation of the boron.

    Original languageEnglish
    Title of host publicationMaterials Research Society Symposium Proceedings
    Pages159-163
    Number of pages5
    Volume912
    Publication statusPublished - 2006
    Event2006 MRS Spring Meeting - San Francisco, United States
    Duration: 18 Apr 200619 Apr 2006

    Conference

    Conference2006 MRS Spring Meeting
    Country/TerritoryUnited States
    CitySan Francisco
    Period18/04/0619/04/06

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