Debris-free Cutting of Quartz with Zero Kerf Width and Ultra-low Surface Roughness Using Femtosecond Bessel Laser Beam Filamentation

Zhaoqing Li, Wei Guo, Olivier Allegre, C-G Liu, W-Y Gao, X-F Wang, Z-X Hou, K Li, L Zhang, Lin Li

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Abstract

Quartz is a hard and brittle material that is difficult to cut with mechanical
tools without generating microcracks and debris, leading to potential
weakening of the material and scratches. Herein we present the findings
of an investigation into high quality quartz (JKS2) cutting with high uniformity
and repeatability using a Ti:Sapphire femtosecond pulse nondiffraction
zero order Bessel laser beam filamentation to induce a change
in material refractive index followed by mechanical cleavage. The Bessel
beam was generated by passing the laser beam through an axicon lens
with a physical angle of 20.0o. Our experimental results show that vertical
wall stealth dicing can be achieved with workpiece thicknesses of 0.5 mm
and 1 mm with a zero cut kerf width and with no debris or microcracks on
the cut surface. The cut surface roughness was below 340 nm Ra. The
effects of pulse energy and scanning speed of Bessel beam on cleavage
force and sidewall surface roughness were discussed.
Original languageEnglish
JournalLasers in Engineering
Publication statusPublished - 1 Jun 2020

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