Deposition of Ti-N compounds by thermionically assisted triode reactive ion plating

A. Matthews*, D. G. Teer

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Details are given of the influence of the ion current density on the properties of Ti-N compounds deposited at low temperatures (<600°C) by a thermionically assisted triode reactive ion-plating technique. As the chamber pressure increases, greater specimen currents are necessary, both to prevent the deposition of powdery TiN and also to ensure reaction for the formation of Ti2N and TiN at lower partial pressures of nitrogen. The ionization efficiency, being related to both pressure and current density, is suggested as a suitable parameter for defining optimum conditions. An ionization efficiency of about 0.3% is identified as the minimum required for the deposition of cohesive TiN, whilst values above this improve the densification and the hardness.

Original languageEnglish
Pages (from-to)541-549
Number of pages9
JournalThin Solid Films
Volume72
Issue number3
DOIs
Publication statusPublished - 1 Jan 1980

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