Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength

X. L. Zhong; M. Gupta

doi:10.1088/0022-3727/41/9/095403

Development of lead-free Sn-0.7Cu/Al₂O₃ nanocomposite solders with superior strength

X. L. Zhong, M. Gupta

Materials - Administration

National University of Singapore (NUS)

Research output: Contribution to journal › Article › peer-review

Abstract

Sn-0.7Cu is a low cost lead-free solder alloy that is targeted to replace the eutectic Sn-Pb solder. The main limitation of this alloy is its poor strength characteristics. Accordingly, this study aims at improving the mechanical properties of Sn-0.7Cu using Al2O3 particulates in the nanolength scale. The development of nanocomposite solders was accomplished using the powder metallurgy technique incorporating microwave sintering. Results of characterization studies conducted on the extruded samples revealed the presence of equiaxed grains, Cu6Sn5 phase and pores. The mechanical properties (microhardness, 0.2%YS and UTS) increase with the increasing presence of reinforcement with the best tensile strength realized for the composite containing 1.5% alumina that far exceeds the strength of the eutectic Sn-Pb solder.

Original language	English
Article number	095403
Pages (from-to)	1-7
Number of pages	7
Journal	Journal of Physics D: Applied Physics
Volume	41
Issue number	9
DOIs	https://doi.org/10.1088/0022-3727/41/9/095403
Publication status	Published - 3 Apr 2008

Keywords

Alumina
Lead
NanocompositesP
Powder metallurgy
Tensile strength
Tin alloys
Nanocomposite solders
Strength characteristics
Soldering alloys

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10.1088/0022-3727/41/9/095403

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title = "Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength",

abstract = "Sn-0.7Cu is a low cost lead-free solder alloy that is targeted to replace the eutectic Sn-Pb solder. The main limitation of this alloy is its poor strength characteristics. Accordingly, this study aims at improving the mechanical properties of Sn-0.7Cu using Al2O3 particulates in the nanolength scale. The development of nanocomposite solders was accomplished using the powder metallurgy technique incorporating microwave sintering. Results of characterization studies conducted on the extruded samples revealed the presence of equiaxed grains, Cu6Sn5 phase and pores. The mechanical properties (microhardness, 0.2%YS and UTS) increase with the increasing presence of reinforcement with the best tensile strength realized for the composite containing 1.5% alumina that far exceeds the strength of the eutectic Sn-Pb solder.",

keywords = "Alumina, Lead, NanocompositesP, Powder metallurgy, Tensile strength, Tin alloys, Nanocomposite solders, Strength characteristics, Soldering alloys",

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AU - Zhong, X. L.

AU - Gupta, M.

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N2 - Sn-0.7Cu is a low cost lead-free solder alloy that is targeted to replace the eutectic Sn-Pb solder. The main limitation of this alloy is its poor strength characteristics. Accordingly, this study aims at improving the mechanical properties of Sn-0.7Cu using Al2O3 particulates in the nanolength scale. The development of nanocomposite solders was accomplished using the powder metallurgy technique incorporating microwave sintering. Results of characterization studies conducted on the extruded samples revealed the presence of equiaxed grains, Cu6Sn5 phase and pores. The mechanical properties (microhardness, 0.2%YS and UTS) increase with the increasing presence of reinforcement with the best tensile strength realized for the composite containing 1.5% alumina that far exceeds the strength of the eutectic Sn-Pb solder.

AB - Sn-0.7Cu is a low cost lead-free solder alloy that is targeted to replace the eutectic Sn-Pb solder. The main limitation of this alloy is its poor strength characteristics. Accordingly, this study aims at improving the mechanical properties of Sn-0.7Cu using Al2O3 particulates in the nanolength scale. The development of nanocomposite solders was accomplished using the powder metallurgy technique incorporating microwave sintering. Results of characterization studies conducted on the extruded samples revealed the presence of equiaxed grains, Cu6Sn5 phase and pores. The mechanical properties (microhardness, 0.2%YS and UTS) increase with the increasing presence of reinforcement with the best tensile strength realized for the composite containing 1.5% alumina that far exceeds the strength of the eutectic Sn-Pb solder.

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KW - Tensile strength

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KW - Strength characteristics

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Development of lead-free Sn-0.7Cu/Al₂O₃ nanocomposite solders with superior strength

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Keywords

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