Diffusion bonds in copper

B. Derby; E. R. Wallach

doi:10.1007/BF00549797

Diffusion bonds in copper

B. Derby, E. R. Wallach

Research output: Contribution to journal › Article › peer-review

Abstract

The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses. However, for smoother surfaces, diffusional mass transfer mechanisms become increasingly more important. © 1984 Chapman and Hall Ltd.

Original language	English
Pages (from-to)	3140-3148
Number of pages	8
Journal	Journal of Materials Science
Volume	19
Issue number	10
DOIs	https://doi.org/10.1007/BF00549797
Publication status	Published - Oct 1984

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title = "Diffusion bonds in copper",

abstract = "The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses. However, for smoother surfaces, diffusional mass transfer mechanisms become increasingly more important. {\textcopyright} 1984 Chapman and Hall Ltd.",

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AU - Wallach, E. R.

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AB - The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses. However, for smoother surfaces, diffusional mass transfer mechanisms become increasingly more important. © 1984 Chapman and Hall Ltd.

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U2 - 10.1007/BF00549797

DO - 10.1007/BF00549797

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SN - 0022-2461

VL - 19

SP - 3140

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JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 10

ER -

Diffusion bonds in copper

Abstract

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