TY - JOUR
T1 - Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology - Sensing Head Interfacing
AU - Durovic, Sinisa
AU - Barnes, Mike
AU - Vilchis-Rodriguez, Damian
AU - Chen, Shiying
AU - Mckeever, Paul M
AU - Jia, Chunjiang
PY - 2022/1/15
Y1 - 2022/1/15
N2 - This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.
AB - This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.
U2 - 10.1109/JSEN.2021.3131322
DO - 10.1109/JSEN.2021.3131322
M3 - Article
SN - 1530-437X
VL - 22
SP - 1309
EP - 1320
JO - IEEE Sensors Journal
JF - IEEE Sensors Journal
IS - 2
ER -