Eddy Current Measurement for Planar Structures

Zihan Xia; Ruochen Huang; Ziqi Chen; Kuohai Yu; Zhijie Zhang; Jorge Ricardo Salas-Avila; Wuliang Yin

doi:10.3390/s22228695

Eddy Current Measurement for Planar Structures

Zihan Xia, Ruochen Huang, Ziqi Chen, Kuohai Yu, Zhijie Zhang, Jorge Ricardo Salas-Avila, Wuliang Yin

Research output: Contribution to journal › Review article › peer-review

Abstract

Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic properties, and defects of metallic planar structures based on electromagnetic principles. In this review, we summarize recent developments in EC computational models, systems, algorithms, and measurement approaches for planar structures. First, the computational models including analytical models, numerical methods, and plate property estimation algorithms are introduced. Subsequently, the impedance measurement system and probes are presented. In plate measurements, sensor signals are sensitive to probe lift-off, and various algorithms for reducing the lift-off effect are reviewed. These approaches can be used for measureing thickness and electromagnetic properties. Furthermore, defect detection for metallic plates is also discussed.

Original language	English
Article number	8695
Pages (from-to)	8695
Journal	Sensors
Volume	22
Issue number	22
DOIs	https://doi.org/10.3390/s22228695
Publication status	Published - 10 Nov 2022

Keywords

eddy current testing
electromagnetic induction
measurement
planar structure
theoretical calculation

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10.3390/s22228695

https://www.mdpi.com/1424-8220/22/22/8695

Electromagnetic Sensing Group
Peyton, A. (PI), Fletcher, A. (Researcher), Daniels, D. (CoI), Conniffe, D. (PGR student), Podd, F. (PI), Davidson, J. (Researcher), Anderson, J. (Support team), Wilson, J. (Researcher), Marsh, L. (PI), O'Toole, M. (PI), Watson, S. (PGR student), Yin, W. (PI), Regan, A. (PGR student), Williams, K. (Researcher), Rana, S. (Researcher), Khalil, K. (PGR student), Hills, D. (PGR student), Whyte, C. (PGR student), Wang, C. (PGR student), Hodgskin-Brown, R. (PGR student), Dadkhahtehrani, F. (PGR student), Forster, S. (PGR student), Zhu, F. (PGR student), Yu, K. (PGR student), Xiong, L. (PGR student), Lu, T. (PGR student), Zhang, L. (PGR student), Lyu, R. (PGR student), Zhu, R. (PGR student), She, S. (PGR student), Meng, T. (PGR student), Pang, X. (PGR student), Zheng, X. (PGR student), Bai, X. (PGR student), Zou, X. (PGR student), Ding, Y. (PGR student), Shao, Y. (PGR student), Xia, Z. (PGR student), Zhang, Z. (PGR student), Khangerey, R. (PGR student) & Lawless, B. (Researcher)
1/10/04 → …
Project: Research

Cite this

@article{8811e2985bab400e927cdb42db1651f9,

title = "Eddy Current Measurement for Planar Structures",

abstract = "Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic properties, and defects of metallic planar structures based on electromagnetic principles. In this review, we summarize recent developments in EC computational models, systems, algorithms, and measurement approaches for planar structures. First, the computational models including analytical models, numerical methods, and plate property estimation algorithms are introduced. Subsequently, the impedance measurement system and probes are presented. In plate measurements, sensor signals are sensitive to probe lift-off, and various algorithms for reducing the lift-off effect are reviewed. These approaches can be used for measureing thickness and electromagnetic properties. Furthermore, defect detection for metallic plates is also discussed.",

keywords = "eddy current testing, electromagnetic induction, measurement, planar structure, theoretical calculation",

author = "Zihan Xia and Ruochen Huang and Ziqi Chen and Kuohai Yu and Zhijie Zhang and Salas-Avila, {Jorge Ricardo} and Wuliang Yin",

note = "Funding Information: This research was financially supported by The Chinese NSF 52166004, The Royal Society IEC\NSFC\211165, China Scholarship Council (CSC), and the 2022 IEEE I&M Society Graduate Fellowship Award. Publisher Copyright: {\textcopyright} 2022 by the authors.",

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doi = "10.3390/s22228695",

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AU - Xia, Zihan

AU - Huang, Ruochen

AU - Chen, Ziqi

AU - Yu, Kuohai

AU - Zhang, Zhijie

AU - Salas-Avila, Jorge Ricardo

AU - Yin, Wuliang

N1 - Funding Information: This research was financially supported by The Chinese NSF 52166004, The Royal Society IEC\NSFC\211165, China Scholarship Council (CSC), and the 2022 IEEE I&M Society Graduate Fellowship Award. Publisher Copyright: © 2022 by the authors.

PY - 2022/11/10

Y1 - 2022/11/10

N2 - Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic properties, and defects of metallic planar structures based on electromagnetic principles. In this review, we summarize recent developments in EC computational models, systems, algorithms, and measurement approaches for planar structures. First, the computational models including analytical models, numerical methods, and plate property estimation algorithms are introduced. Subsequently, the impedance measurement system and probes are presented. In plate measurements, sensor signals are sensitive to probe lift-off, and various algorithms for reducing the lift-off effect are reviewed. These approaches can be used for measureing thickness and electromagnetic properties. Furthermore, defect detection for metallic plates is also discussed.

AB - Eddy current (EC) testing has become one of the most common techniques for measuring metallic planar structures in various industrial scenarios such as infrastructures, automotive, manufacturing, and chemical engineering. There has been significant progress in measuring the geometry, electromagnetic properties, and defects of metallic planar structures based on electromagnetic principles. In this review, we summarize recent developments in EC computational models, systems, algorithms, and measurement approaches for planar structures. First, the computational models including analytical models, numerical methods, and plate property estimation algorithms are introduced. Subsequently, the impedance measurement system and probes are presented. In plate measurements, sensor signals are sensitive to probe lift-off, and various algorithms for reducing the lift-off effect are reviewed. These approaches can be used for measureing thickness and electromagnetic properties. Furthermore, defect detection for metallic plates is also discussed.

KW - eddy current testing

KW - electromagnetic induction

KW - measurement

KW - planar structure

KW - theoretical calculation

U2 - 10.3390/s22228695

DO - 10.3390/s22228695

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VL - 22

SP - 8695

JO - Sensors

JF - Sensors

IS - 22

M1 - 8695

ER -

Eddy Current Measurement for Planar Structures

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