Effect of fluorine implantation dose on boron thermal diffusion in silicon

H. A W El Mubarek, J. M. Bonar, G. D. Dilliway, P. Ashburn, M. Karunaratne, A. F. Willoughby, Y. Wang, P. L F Hemment, R. Price, J. Zhang, P. Ward

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The effect of flouring implantation with a dose in the range of 5×1014∓2.3×1015 cm ∓2 on boron thermal diffusion in silicon was investigated. The Secondary Ion Mass Spectroscopy (SIMS) profiles of boron mark layers were presented for fluorine doses and compared with fluorine profiles. It was observed that the SIMS profiles exhibited reduced boron thermal diffusion above a critical F+ dose of 0.9∓1.4×1015 cm ∓2. The result shows that the suppression of ]boron thermal diffusion is due to the effect of the clusters in suppressing the concentration of boron.
    Original languageEnglish
    Pages (from-to)4114-4121
    Number of pages7
    JournalJournal of Applied Physics
    Volume96
    Issue number8
    DOIs
    Publication statusPublished - 15 Oct 2004

    Fingerprint

    Dive into the research topics of 'Effect of fluorine implantation dose on boron thermal diffusion in silicon'. Together they form a unique fingerprint.

    Cite this