Effect of type of reinforcement at nanolength scale on the tensile properties of Sn-0.7Cu solder alloy

X. L. Zhong, M. Gupta

    Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

    Abstract

    In this study, Sn-0.7Cu solder alloy was reinforced with A1 2O3 (50nm) and ZrO2 (45nm) nano particulates to form Sn-0.7Cu/Al2O3 and Sn-0.7Cu/ZrO2 composites. The volume percentage of the A12O3 and ZrO2 nanoparticulates reinforcement was kept at 1.5%. The composites were synthesized using powder metallurgy technique assisted with microwave sintering and incorporating hot extrusion as secondary processing technique. The extruded materials were characterized in terms of microstructural, physical and mechanical properties. The density values of composite solder materials were found to be lower when compared to monolithic alloy. Microstructure characterization revealed bigger pores in Sn-0.7Cu/ZrO2 composite samples compared to Sn-0.7Cu/Al2O3 composite samples. The results of room temperature tensile testing revealed that 0.2% yield strength and ultimate tensile strength of composite solder materials increased when compared to monolithic solder. Among the composite solders, the 0.2% yield strength and ultimate tensile strength of Sn-0.7Cu/Al2O3 composite was found to be distinctly superior to Sn-0.7Cu/ZrO2 composite.

    Original languageEnglish
    Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
    Pages669-674
    Number of pages6
    DOIs
    Publication statusPublished - 2008
    Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
    Duration: 9 Dec 200812 Dec 2008

    Publication series

    Name10th Electronics Packaging Technology Conference, EPTC 2008

    Conference

    Conference10th Electronics Packaging Technology Conference, EPTC 2008
    Country/TerritorySingapore
    CitySingapore
    Period9/12/0812/12/08

    Keywords

    • Environmentally friendly manufacturing techniques
    • Lead
    • Composite materials
    • Powders
    • Billets
    • Microwave ovens
    • Tin

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