Efficient Modeling of Crosstalk Noise On Power Distribution Networks for Contactless 3-D ICs

An efficient and frequency-dependent model
describing the crosstalk noise on power distribution networks
due to inductive links in contactless 3-D ICs is presented. A twostep
approach is followed to model the crosstalk effect. During the
first step, the mutual inductance between the power distribution
network and the inductive link is analytically determined. Due
to the weak dependence of mutual inductance to frequency,
a magnetostatic model is proposed for this step. The model
includes the physical and electrical characteristics of both the
on-chip inductor and the wires of the power distribution network.
In this way, different power network topologies can be modeled
facilitating noise analysis in the vicinity of the on-chip inductor.
This approach is justified by the typical use of regular power
network topologies in modern integrated circuits. In the second
stage, the noise is assessed with SPICE simulations, considering
the mutual inductance between the two structures from the
first step and the resistance variations due to high frequency
effects. Thus, an efficient, scalable, and accurate method for
the analysis of the crosstalk effects due to inductive links is
provided, without resorting on computationally expensive and
time consuming full-wave simulations. Compared with the fullwave
simulations, the induced noise is evaluated four orders of
magnitude faster with the proposed model. The accuracy of the
proposed model is within 10% of the respective noise computed
with a commercial electromagnetics simulator using the finite
element method. An analysis including the effect of substrate
resistivity on the crosstalk noise is also presented.