Electrodeposition of indium for bump bonding

Tian, Y., Liu, C., Hutt, D. A., & Stevens, R. (2008). Electrodeposition of indium for bump bonding.

Tian, Y ; Liu, C ; Hutt, D A et al. / Electrodeposition of indium for bump bonding. 2008.

@misc{c3066d7a6a9c4a26bc14f50c2eae1e4a,

title = "Electrodeposition of indium for bump bonding",

author = "Y Tian and C Liu and Hutt, \{D A\} and R Stevens",

year = "2008",

language = "English",

type = "Other",

}

Tian, Y, Liu, C, Hutt, DA & Stevens, R 2008, Electrodeposition of indium for bump bonding.

Electrodeposition of indium for bump bonding. / Tian, Y; Liu, C; Hutt, D A et al.
2008.

Research output: Other contribution

TY - GEN

T1 - Electrodeposition of indium for bump bonding

AU - Tian, Y

AU - Liu, C

AU - Hutt, D A

AU - Stevens, R

PY - 2008

Y1 - 2008

M3 - Other contribution

ER -

Original language	English
Publication status	Published - 2008

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