EUROSERVER: Energy Efficient Node for European Micro-Servers

Y. Durand; P.M. Carpenter; S. Adami; A. Bilas; D. Dutoit; A. Farcy; G. Gaydadjiev; J. Goodacre; M. Katevenis; M. Marazakis; E. Matus; I. Mavroidis; J. Thomson

doi:10.1109/DSD.2014.15

EUROSERVER: Energy Efficient Node for European Micro-Servers

Y. Durand, P.M. Carpenter, S. Adami, A. Bilas, D. Dutoit, A. Farcy, G. Gaydadjiev, J. Goodacre, M. Katevenis, M. Marazakis, E. Matus, I. Mavroidis, J. Thomson

Advanced Processor Technology

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

Abstract

EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon "chiplets" on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

Original language	English
Title of host publication	host publication
Publisher	IEEE
Pages	206-213
Number of pages	8
DOIs	https://doi.org/10.1109/DSD.2014.15
Publication status	Published - 2014
Event	2014 17th Euromicro Conference on Digital System Design (DSD) - Verona Duration: 27 Aug 2014 → 29 Aug 2014

Conference

Conference	2014 17th Euromicro Conference on Digital System Design (DSD)
City	Verona
Period	27/08/14 → 29/08/14

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/DSD.2014.15

Cite this

@inproceedings{580d9da309ea44e7a785156567c13024,

title = "EUROSERVER: Energy Efficient Node for European Micro-Servers",

abstract = "EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon {"}chiplets{"} on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.",

author = "Y. Durand and P.M. Carpenter and S. Adami and A. Bilas and D. Dutoit and A. Farcy and G. Gaydadjiev and J. Goodacre and M. Katevenis and M. Marazakis and E. Matus and I. Mavroidis and J. Thomson",

year = "2014",

doi = "10.1109/DSD.2014.15",

language = "English",

pages = "206--213",

booktitle = "host publication",

publisher = "IEEE",

address = "United States",

note = "2014 17th Euromicro Conference on Digital System Design (DSD) ; Conference date: 27-08-2014 Through 29-08-2014",

}

Durand, Y, Carpenter, PM, Adami, S, Bilas, A, Dutoit, D, Farcy, A, Gaydadjiev, G, Goodacre, J, Katevenis, M, Marazakis, M, Matus, E, Mavroidis, I & Thomson, J 2014, EUROSERVER: Energy Efficient Node for European Micro-Servers. in host publication. IEEE, pp. 206-213, 2014 17th Euromicro Conference on Digital System Design (DSD), Verona, 27/08/14. https://doi.org/10.1109/DSD.2014.15

TY - GEN

T1 - EUROSERVER: Energy Efficient Node for European Micro-Servers

AU - Durand, Y.

AU - Carpenter, P.M.

AU - Adami, S.

AU - Bilas, A.

AU - Dutoit, D.

AU - Farcy, A.

AU - Gaydadjiev, G.

AU - Goodacre, J.

AU - Katevenis, M.

AU - Marazakis, M.

AU - Matus, E.

AU - Mavroidis, I.

AU - Thomson, J.

PY - 2014

Y1 - 2014

N2 - EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon "chiplets" on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

AB - EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon "chiplets" on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

U2 - 10.1109/DSD.2014.15

DO - 10.1109/DSD.2014.15

M3 - Conference contribution

SP - 206

EP - 213

BT - host publication

PB - IEEE

T2 - 2014 17th Euromicro Conference on Digital System Design (DSD)

Y2 - 27 August 2014 through 29 August 2014

ER -

EUROSERVER: Energy Efficient Node for European Micro-Servers

Abstract

Conference

UN SDGs

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