Fabrication Cost Analysis for Contactless 3-D ICs

Engineering

• Fabrication 100%
• Integration 75%
• Inductor 50%
• Integration Approach 50%
• Yields 25%
• Manufacturing Cost 25%
• Cost Estimation 25%
• Data Rate 25%
• Processing Step 25%
• Performance 25%
• Transceiver 25%
• Process Technology 25%
• Assuming 25%
• Couplings 25%
• Efficiency 25%

Physics

• Fabrication 100%
• Area 75%
• Wafer 75%
• Performance 25%
• Process Technology 25%
• Distance 25%

Computer Science

• Inductive Link 100%
• Communication 25%
• Manufacturing Cost 25%
• Case Study 25%
• Fabrication Process 25%
• Processing Step 25%
• Coupling Efficiency 25%
• Cost Estimation 25%