FBG Array Sensor Use for Distributed Internal Thermal Monitoring in Low Voltage Random Wound Coils

Anees Mohammed; Sinisa Durovic

doi:10.1109/MECO.2017.7977124

FBG Array Sensor Use for Distributed Internal Thermal Monitoring in Low Voltage Random Wound Coils

Anees Mohammed, Sinisa Durovic

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Abstract

This study examines the performance potential of FBG array thermal sensors for distributed monitoring of internal temperature in random wound electric coils. The sensor packaging and installation procedures are reported and its thermal monitoring performance assessed in laboratory tests on a prototype coil test system. The reported results indicate that a coil embedded FBG array thermal sensor can provide enhanced internal temperature monitoring and deliver information on thermal stress distribution within the coil structure.

Original language	English
Title of host publication	6th Mediterranean Conference on Embedded Computing
Publisher	IEEE
Pages	1-4
Number of pages	4
DOIs	https://doi.org/10.1109/MECO.2017.7977124
Publication status	Published - 12 Apr 2017
Event	IEEE 6th Mediterranean Conference on Embedded Computing - Montenegro, Bar, Montenegro Duration: 11 Jun 2017 → 17 Jun 2017 http://embeddedcomputing.me/en/meco-2017

Conference

Conference	IEEE 6th Mediterranean Conference on Embedded Computing
Abbreviated title	IEEE MECO 2017
Country/Territory	Montenegro
City	Bar
Period	11/06/17 → 17/06/17
Internet address	http://embeddedcomputing.me/en/meco-2017

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10.1109/MECO.2017.7977124

Meco_2017_FD3Accepted author manuscript, 1 MB

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@inproceedings{b330b4ea6951407d9114fe4ff63f6753,

title = "FBG Array Sensor Use for Distributed Internal Thermal Monitoring in Low Voltage Random Wound Coils",

abstract = "This study examines the performance potential of FBG array thermal sensors for distributed monitoring of internal temperature in random wound electric coils. The sensor packaging and installation procedures are reported and its thermal monitoring performance assessed in laboratory tests on a prototype coil test system. The reported results indicate that a coil embedded FBG array thermal sensor can provide enhanced internal temperature monitoring and deliver information on thermal stress distribution within the coil structure. ",

author = "Anees Mohammed and Sinisa Durovic",

year = "2017",

month = apr,

day = "12",

doi = "10.1109/MECO.2017.7977124",

language = "English",

pages = "1--4",

booktitle = "6th Mediterranean Conference on Embedded Computing",

publisher = "IEEE",

address = "United States",

note = "IEEE 6th Mediterranean Conference on Embedded Computing, IEEE MECO 2017 ; Conference date: 11-06-2017 Through 17-06-2017",

url = "http://embeddedcomputing.me/en/meco-2017",

}

TY - GEN

T1 - FBG Array Sensor Use for Distributed Internal Thermal Monitoring in Low Voltage Random Wound Coils

AU - Mohammed, Anees

AU - Durovic, Sinisa

PY - 2017/4/12

Y1 - 2017/4/12

N2 - This study examines the performance potential of FBG array thermal sensors for distributed monitoring of internal temperature in random wound electric coils. The sensor packaging and installation procedures are reported and its thermal monitoring performance assessed in laboratory tests on a prototype coil test system. The reported results indicate that a coil embedded FBG array thermal sensor can provide enhanced internal temperature monitoring and deliver information on thermal stress distribution within the coil structure.

AB - This study examines the performance potential of FBG array thermal sensors for distributed monitoring of internal temperature in random wound electric coils. The sensor packaging and installation procedures are reported and its thermal monitoring performance assessed in laboratory tests on a prototype coil test system. The reported results indicate that a coil embedded FBG array thermal sensor can provide enhanced internal temperature monitoring and deliver information on thermal stress distribution within the coil structure.

U2 - 10.1109/MECO.2017.7977124

DO - 10.1109/MECO.2017.7977124

M3 - Conference contribution

SP - 1

EP - 4

BT - 6th Mediterranean Conference on Embedded Computing

PB - IEEE

T2 - IEEE 6th Mediterranean Conference on Embedded Computing

Y2 - 11 June 2017 through 17 June 2017

ER -

FBG Array Sensor Use for Distributed Internal Thermal Monitoring in Low Voltage Random Wound Coils

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Conference

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