FBG Head Size Influence on Localized On-chip Thermal Measurement in IGBT Power Modules

Sinisa Durovic; Mike Barnes; Damian Vilchis-Rodriguez; Shiying Chen; Paul M Mckeever; Chunjiang  Jia

doi:10.1109/JSEN.2022.3210708

FBG Head Size Influence on Localized On-chip Thermal Measurement in IGBT Power Modules

Sinisa Durovic, Mike Barnes, Damian Vilchis-Rodriguez, Shiying Chen, Paul M Mckeever, Chunjiang Jia

Offshore Renewable Energy Catapult

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Abstract

This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.

Original language	English
Pages (from-to)	21684 - 21693
Number of pages	10
Journal	IEEE Sensors Journal
Volume	22
Issue number	22
Early online date	10 Oct 2022
DOIs	https://doi.org/10.1109/JSEN.2022.3210708
Publication status	Published - 15 Nov 2022

Keywords

FBG sensor
Fiber Bragg grating (FBG) head size
insulated gate bipolar transistor (IGBT)
junction temperature
on-chip thermal sensing
thermal distribution

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10.1109/JSEN.2022.3210708

Paper_FBG head size influence__final_acceptedAccepted author manuscript, 2.21 MB

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title = "FBG Head Size Influence on Localized On-chip Thermal Measurement in IGBT Power Modules",

abstract = "This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.",

keywords = "FBG sensor, Fiber Bragg grating (FBG) head size, insulated gate bipolar transistor (IGBT), junction temperature, on-chip thermal sensing, thermal distribution",

author = "Sinisa Durovic and Mike Barnes and Damian Vilchis-Rodriguez and Shiying Chen and Mckeever, {Paul M} and Chunjiang Jia",

year = "2022",

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doi = "10.1109/JSEN.2022.3210708",

language = "English",

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journal = "IEEE Sensors Journal",

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T1 - FBG Head Size Influence on Localized On-chip Thermal Measurement in IGBT Power Modules

AU - Durovic, Sinisa

AU - Barnes, Mike

AU - Vilchis-Rodriguez, Damian

AU - Chen, Shiying

AU - Mckeever, Paul M

AU - Jia, Chunjiang

PY - 2022/11/15

Y1 - 2022/11/15

N2 - This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.

AB - This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.

KW - FBG sensor

KW - Fiber Bragg grating (FBG) head size

KW - insulated gate bipolar transistor (IGBT)

KW - junction temperature

KW - on-chip thermal sensing

KW - thermal distribution

U2 - 10.1109/JSEN.2022.3210708

DO - 10.1109/JSEN.2022.3210708

M3 - Article

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EP - 21693

JO - IEEE Sensors Journal

JF - IEEE Sensors Journal

IS - 22

ER -

FBG Head Size Influence on Localized On-chip Thermal Measurement in IGBT Power Modules

Abstract

Keywords

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