FEM analysis of failure process in thin film during wear test

Engineering

• Failure Process 100%
• Thin Films 100%
• Delamination 100%
• Testing Machine 50%
• Tensile Stress σ 50%
• Film Surface 50%
• Main Reason 50%
• Crack Propagation 50%
• Maximum Principal Stress 50%
• Maximum Tensile Stress 50%
• Disc Type 50%
• Back Contact 50%
• Crack Tip 50%