General-purpose 128×128 SIMD processor array with integrated image sensor

P. Dudek; S. J. Carey

doi:10.1049/el:20060352

General-purpose 128×128 SIMD processor array with integrated image sensor

P. Dudek
, S. J. Carey

Research output: Contribution to journal › Article › peer-review

Abstract

A CMOS image sensor/processor chip fabricated in a 0.35m CMOS technology is presented. The chip contains a general purpose software-programmable SIMD array of 128×128 processing elements. It executes over 20 GOPS while dissipating 240mW of power and achieves pixel-processor density of 410cells/mm2. Performance and accuracy measurement results are given.

Original language	English
Pages (from-to)	678-679
Number of pages	1
Journal	Electronics Letters
Volume	42
Issue number	12
DOIs	https://doi.org/10.1049/el:20060352
Publication status	Published - 2006

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@article{1824a5eb429a463ba4dc7ab735262a4f,

title = "General-purpose 128×128 SIMD processor array with integrated image sensor",

abstract = "A CMOS image sensor/processor chip fabricated in a 0.35m CMOS technology is presented. The chip contains a general purpose software-programmable SIMD array of 128×128 processing elements. It executes over 20 GOPS while dissipating 240mW of power and achieves pixel-processor density of 410cells/mm2. Performance and accuracy measurement results are given.",

author = "P. Dudek and Carey, \{S. J.\}",

year = "2006",

doi = "10.1049/el:20060352",

language = "English",

volume = "42",

pages = "678--679",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "John Wiley \& Sons Ltd",

number = "12",

}

TY - JOUR

T1 - General-purpose 128×128 SIMD processor array with integrated image sensor

AU - Dudek, P.

AU - Carey, S. J.

PY - 2006

Y1 - 2006

N2 - A CMOS image sensor/processor chip fabricated in a 0.35m CMOS technology is presented. The chip contains a general purpose software-programmable SIMD array of 128×128 processing elements. It executes over 20 GOPS while dissipating 240mW of power and achieves pixel-processor density of 410cells/mm2. Performance and accuracy measurement results are given.

AB - A CMOS image sensor/processor chip fabricated in a 0.35m CMOS technology is presented. The chip contains a general purpose software-programmable SIMD array of 128×128 processing elements. It executes over 20 GOPS while dissipating 240mW of power and achieves pixel-processor density of 410cells/mm2. Performance and accuracy measurement results are given.

U2 - 10.1049/el:20060352

DO - 10.1049/el:20060352

M3 - Article

SN - 0013-5194

VL - 42

SP - 678

EP - 679

JO - Electronics Letters

JF - Electronics Letters

IS - 12

ER -

General-purpose 128×128 SIMD processor array with integrated image sensor

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