High Spatial Resolution Evaluation of Residual Stresses in Shot Peened Specimens Containing Sharp and Blunt Notches by Micro-hole Drilling, Micro-slot Cutting and Micro-X-ray Diffraction Methods

B. Winiarski, M. Benedetti, V. Fontanari, M. Allahkarami, J. C. Hanan, P. J. Withers

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The moderately high lateral RS gradients (on the order of tens of MPa/μm) near shot peened notches in conjunction with the shallow treatment depth (some hundreds of microns) limit the application of far-field and/or high resolution synchrotron diffraction residual stress measurement techniques. Recently proposed Focused Ion Beam – Scanning Elecron Microscope – Digital Image Correlation (FIB-SEM-DIC) based micro mechanical stress relaxation methods for the measurement of residual stress at the micron scale became suitable techniques for local evaluation of residual stresses and stress gradients in shot peened specimens. In this paper ultra-high resolution (~0.5–0.8 μm depth and 5–10 μm lateral resolution) mechanical relaxation stress measurements were used to evaluate the stress variation local to individual peening dimples in ceramic (60–120 μm diameter beads) shot peened Al-7075-T651 double notched samples having 0.15, 0.5 and 2.0 mm radii using Micro-Hole Drilling (μHD), Micro-Slot Cutting (μSC) and micro X-ray Diffraction (μXRD) methods. The micron-sized sampling volumes enabled the stress to be evaluated in individual impact craters (dimples) showing significant point-to-point variation (~ +/−150 MPa) (with certain dimples even recording tensile stresses). After around 30 μm of layer removal the heavily deformed region had largely been removed and the stress profile became much more homogeneous. At this depth the μHD and μSC results were in good accord with those from μXRD measurements which sample over a much larger volume (~40 μm depth × 50 μm laterally) showing an in-plane compressive stress of around 150 MPa far from the notches with the residual stress rising to about 200 MPa at a blunt (2 mm) notch and 500 MPa for a sharp (0.15 mm) one. Further, these recorded variations of residual stresses were correlated with microstructural features, e.g. grains, networks of sub-surface cracks, intermetallics and highly deformed sub-surface regions, revealed by large volume Serial Sectioning Tomography using Plasma Xe+ Focus Ion Beam – Scanning Electron Microscope (PFIB-SEM), EDS and EBSD maps. This allowed for the first time characterize large volume (100 × 66 × 30 μm3) of shot peened regions with resolution of dozens of nanometers and correlate residual stress depth profiles with 3D microstructural features. Finally, in (Benedetti et al. 2016, Int. J. Fatigue) these RS measurements are used to reconstruct the RS field through finite element (FE) analyses.

    Original languageEnglish
    Pages (from-to)1-15
    Number of pages15
    JournalExperimental Mechanics
    DOIs
    Publication statusPublished - 10 Jun 2016

    Keywords

    • Al-7075-T651
    • FIB micro-hole drilling
    • Focused ion beam (FIB) micro-slot cutting
    • Plasma Xe FIB-SEM
    • Residual stress
    • Serial sectioning tomography
    • Shot peening
    • XRD

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