High Strength Lead‐Free Composite Solder Materials using Nano Al2O3 as Reinforcement

Xiangli Zhong, M Gupta

Research output: Contribution to journalArticlepeer-review

Abstract

High strength light weight lead-free composite solder materials containing varying amount of nano-alumina particulates were synthesized by powder metallurgy process employing different extrusion temperatures. The presence of nano Al2O3 particulates not only enhanced strength and improved dimensional stability but also reduced the weight of the solder alloy matrix. Fairly uniform distribution of the nano-alumina particulates was observed in the composites.
Original languageEnglish
Pages (from-to)1049-1054
Number of pages6
JournalAdvanced Engineering Materials
Volume7
Issue number1
Publication statusPublished - 1 Nov 2005

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