High temperature reactions between SiC and copper

C. D. Qin, B. Derby

    Research output: Contribution to journalArticlepeer-review


    In joining metals to ceramics one major problem is the considerable difference in coefficient of thermal expansion (CTE) between the generally low CTE ceramic and the higher CTE metal. One possible solution to this problem is the use of ductile metal interlayers to accommodate differential thermal strain. Copper is one such potential interlayer material. Therefore the interactions between SiC and Cu are investigated in this study.
    Original languageEnglish
    Pages (from-to)124-125
    Number of pages1
    JournalBritish Ceramic. Transactions and Journal
    Issue number4
    Publication statusPublished - 1991


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