High-temperature strain field measurement using digital image correlation

BMB Grant, HJ Stone, Philip Withers, M Preuss

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	263-271
Number of pages	9
Journal	The Journal of Strain Analysis for Engineering Design
Volume	44
Issue number	4
DOIs	https://doi.org/10.1243/03093247JSA478
Publication status	Published - 2009

Keywords

@article{5347c63ecdc94cb488556d416ae2fe64,

title = "High-temperature strain field measurement using digital image correlation",

keywords = "Strain measurement, Thermal expansion measurement, Young's modulus measurement",

author = "BMB Grant and HJ Stone and Philip Withers and M Preuss",

year = "2009",

doi = "10.1243/03093247JSA478",

language = "English",

volume = "44",

pages = "263--271",

journal = "The Journal of Strain Analysis for Engineering Design",

issn = "2041-3130",

publisher = "Sage Publications Ltd",

number = "4",

}

TY - JOUR

T1 - High-temperature strain field measurement using digital image correlation

AU - Grant, BMB

AU - Stone, HJ

AU - Withers, Philip

AU - Preuss, M

PY - 2009

Y1 - 2009

KW - Strain measurement

KW - Thermal expansion measurement

KW - Young's modulus measurement

U2 - 10.1243/03093247JSA478

DO - 10.1243/03093247JSA478

M3 - Article

SN - 2041-3130

SN - 0309-3247

VL - 44

SP - 263

EP - 271

JO - The Journal of Strain Analysis for Engineering Design

JF - The Journal of Strain Analysis for Engineering Design

IS - 4

ER -