IGBT FINITE ELEMENT MODEL FOR FIBRE BRAGG GRATING SENSOR INSTALLATION ANALYSIS

Sinisa Durovic; Mike Barnes; Damian Vilchis-Rodriguez; Shiying Chen; Paul M Mckeever; Chunjiang  Jia

IGBT FINITE ELEMENT MODEL FOR FIBRE BRAGG GRATING SENSOR INSTALLATION ANALYSIS

Sinisa Durovic, Mike Barnes, Damian Vilchis-Rodriguez, Shiying Chen, Paul M Mckeever, Chunjiang Jia

Offshore Renewable Energy Catapult

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Abstract

An IGBT finite element model aimed at facilitating the assessment of Fibre Bragg Grating sensing based direct on-chip temperature monitoring is first presented in this paper. A commercial off-the-shelf IGBT module geometry is characterised, and a thermo-electrical finite element model is then established using its features. The model is subsequently employed to evaluate the local thermal disturbances that may be introduced by the installation of the optical based temperature sensor directly on the top surface of the IGBT chip. The effects of the sensor thermal interface material characteristics, e.g., thermal conductivity and size, in the local temperature environment are investigated.

Original language	English
Pages	1-5
Number of pages	5
Publication status	Published - 21 Jun 2022
Event	IET International Conference on Power Electronics Machines and Drives PEMD 2022 - The Frederic Douglas Centre, Newcastle University, Newcastle, United Kingdom Duration: 21 Jun 2022 → 23 Jun 2022 https://pemd.theiet.org/

Conference

Conference	IET International Conference on Power Electronics Machines and Drives PEMD 2022
Abbreviated title	IET PEMD 2022
Country/Territory	United Kingdom
City	Newcastle
Period	21/06/22 → 23/06/22
Internet address	https://pemd.theiet.org/

Keywords

FBG sensor
IGBT power module
Condition Monitoring

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Cite this

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title = "IGBT FINITE ELEMENT MODEL FOR FIBRE BRAGG GRATING SENSOR INSTALLATION ANALYSIS",

abstract = "An IGBT finite element model aimed at facilitating the assessment of Fibre Bragg Grating sensing based direct on-chip temperature monitoring is first presented in this paper. A commercial off-the-shelf IGBT module geometry is characterised, and a thermo-electrical finite element model is then established using its features. The model is subsequently employed to evaluate the local thermal disturbances that may be introduced by the installation of the optical based temperature sensor directly on the top surface of the IGBT chip. The effects of the sensor thermal interface material characteristics, e.g., thermal conductivity and size, in the local temperature environment are investigated.",

keywords = "FBG sensor, IGBT power module, Condition Monitoring",

author = "Sinisa Durovic and Mike Barnes and Damian Vilchis-Rodriguez and Shiying Chen and Mckeever, {Paul M} and Chunjiang Jia",

year = "2022",

month = jun,

day = "21",

language = "English",

pages = "1--5",

note = "IET International Conference on Power Electronics Machines and Drives PEMD 2022, IET PEMD 2022 ; Conference date: 21-06-2022 Through 23-06-2022",

url = "https://pemd.theiet.org/",

}

TY - CONF

T1 - IGBT FINITE ELEMENT MODEL FOR FIBRE BRAGG GRATING SENSOR INSTALLATION ANALYSIS

AU - Durovic, Sinisa

AU - Barnes, Mike

AU - Vilchis-Rodriguez, Damian

AU - Chen, Shiying

AU - Mckeever, Paul M

AU - Jia, Chunjiang

PY - 2022/6/21

Y1 - 2022/6/21

N2 - An IGBT finite element model aimed at facilitating the assessment of Fibre Bragg Grating sensing based direct on-chip temperature monitoring is first presented in this paper. A commercial off-the-shelf IGBT module geometry is characterised, and a thermo-electrical finite element model is then established using its features. The model is subsequently employed to evaluate the local thermal disturbances that may be introduced by the installation of the optical based temperature sensor directly on the top surface of the IGBT chip. The effects of the sensor thermal interface material characteristics, e.g., thermal conductivity and size, in the local temperature environment are investigated.

AB - An IGBT finite element model aimed at facilitating the assessment of Fibre Bragg Grating sensing based direct on-chip temperature monitoring is first presented in this paper. A commercial off-the-shelf IGBT module geometry is characterised, and a thermo-electrical finite element model is then established using its features. The model is subsequently employed to evaluate the local thermal disturbances that may be introduced by the installation of the optical based temperature sensor directly on the top surface of the IGBT chip. The effects of the sensor thermal interface material characteristics, e.g., thermal conductivity and size, in the local temperature environment are investigated.

KW - FBG sensor

KW - IGBT power module

KW - Condition Monitoring

M3 - Paper

SP - 1

EP - 5

T2 - IET International Conference on Power Electronics Machines and Drives PEMD 2022

Y2 - 21 June 2022 through 23 June 2022

ER -

IGBT FINITE ELEMENT MODEL FOR FIBRE BRAGG GRATING SENSOR INSTALLATION ANALYSIS

Abstract

Conference

Keywords

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