Abstract
GaP/InGaAs/GaAs pseudomorphic high electron mobility transistor (HEMT) structures were grown on 3-inch GaAs (100) substrates by solid source molecular beam epitaxy using polycrystalline GaP as a phosphorous source. The inclusion of a 5 nm thick AlGaAs layer between the InGaP and InGaAs yielded the best electrical characteristics, where the room temperature mobility and sheet carrier concentration were 5200 cm2/V·s and 1.8×1012 cm-2 respectively. A 5×100 μm2 HEMT device fabricated using this structure yielded an extrinsic transconductance of 80 mS/mm.
Original language | English |
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Pages (from-to) | L647-L649 |
Journal | Japanese Journal of Applied Physics, Part 2: Letters |
Volume | 36 |
Issue number | Part 2 : 6 A |
Publication status | Published - 1 Jun 1997 |