Insulating composition useful in high voltage device modules e.g. power electronic modules, comprises a soft dielectric casting compound, which comprises ferroelectric particles dispersed in it

I Cotton (Other), S Follmann (Other), J Robertson (Other), N Wang (Other)

    Research output: Patent

    Abstract

    NOVELTY - Insulating composition (I) comprises a soft dielectric casting compound, which comprises ferroelectric particles dispersed in it. USE - (I) is useful in high voltage device modules (claimed), e.g. power electronic modules. (I) is useful in the prevention of electrical discharge from high voltage devices. ADVANTAGE - (I) is essentially free from gas bubbles and has greater resistance to electrical breakdown particularly for alternating electrical fields. The inclusion of ferroelectric particles in a soft casting composition does not permit the flow of current, and so the resulting composition remains electrically insulating. The soft casting composition has a high thermal conductivity so it eliminates hot-spots located at or near interfaces between the soft casting composition and the encapsulated device. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a high voltage device module comprising a high voltage device in a housing enclosure where the device is covered with (I); (2) preparing (I) comprising: providing precursor components, at least one of which is in liquid form, which are blended to form a soft dielectric casting compound; dispersing ferroelectric particles into one or more of the precursor components, prior to blending the precursor components, and/or into the soft dielectric casting compound followed by blending of the precursor components, prior to completion of gelation of the soft dielectric casting compound, to form (I), where the ferroelectric particles are homogeneously dispersed through (I); and (3) a method for providing (I) around a high voltage device in a housing enclosure comprising providing a high voltage device housed in a housing enclosure having an inlet aperture, providing precursor components, at least one of which is in a liquid form, which are blended to form a soft casting compound, dispersing ferroelectric particles into one or more of the precursor components, prior to blending the precursor components, and/or into the soft casting compound followed by blending of the precursor components, prior to completion of gelation of the soft dielectric casting compound and inserting the soft dielectric casting compound, with ferroelectric particles dispersed in it, into the housing enclosure through the inlet port prior to completion of gelation of the filled soft casting compound, with ferroelectric particles dispersed in it, to form (I).
    Original languageEnglish
    Patent numberWO2009103957-A1
    DOIs
    Publication statusPublished - 2009

    Fingerprint

    Dive into the research topics of 'Insulating composition useful in high voltage device modules e.g. power electronic modules, comprises a soft dielectric casting compound, which comprises ferroelectric particles dispersed in it'. Together they form a unique fingerprint.

    Cite this