Inter-tier crosstalk noise on power delivery networks for 3-D ICs with inductively-coupled interconnects

Ioannis Papistas, Vasilis Pavlidis

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    Inductive links have been proposed as an inter-tier interconnect solution for three-dimensional (3-D) integrated systems. Combined with signal multiplexing, inductive links achieve high communication bandwidth comparable to that of through silicon vias. However, being a wireless medium, electromagnetic coupling between the inductive link and nearby on-chip interconnects can cause voltage fluctuations affecting interconnect performance. Although the interference of interconnects on the operation of inductive links has been investigated, the inverse problem has yet to be explored. Consequently, this paper performs an investigation on the effect of electromagnetic coupling on different topologies of power delivery networks (PDNs) in the vicinity of on-chip inductors. Results indicate that the interdigitated PDN topology suffers from the induced noise due to the inductive links of the neighbouring tiers exhibiting a minimum aggregate noise of 131.3 mV. Alternatively, the paired topologies exhibit a superior noise behaviour, achieving a 39.4% and 35.4% decrease in noise level for paired type I and paired type II topologies, respectively, compared to the interdigitated topology.

    Original languageEnglish
    Title of host publicationGLSVLSI 2016 - Proceedings of the 2016 ACM Great Lakes Symposium on VLSI
    PublisherAssociation for Computing Machinery
    Number of pages6
    ISBN (Electronic)9781450342742
    Publication statusPublished - 18 May 2016
    Event26th ACM Great Lakes Symposium on VLSI, GLSVLSI 2016 - Boston, United States
    Duration: 18 May 201620 May 2016


    Conference26th ACM Great Lakes Symposium on VLSI, GLSVLSI 2016
    Country/TerritoryUnited States


    • Crosstalk noise
    • Inductive links
    • Power delivery networks
    • Wireless 3-D systems


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