Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Hélène Conseil-Gudla; Visweswara C. Gudla; Shruti Borgaonkar; Morten S. Jellesen; Rajan Ambat

doi:10.1007/s10854-016-6292-5

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Hélène Conseil-Gudla^*, Visweswara C. Gudla, Shruti Borgaonkar, Morten S. Jellesen, Rajan Ambat

^*Corresponding author for this work

Technical University of Denmark

Research output: Contribution to journal › Article › peer-review

Abstract

Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.

Original language	English
Pages (from-to)	6138-6151
Number of pages	14
Journal	Journal of Materials Science: Materials in Electronics
Volume	28
Issue number	8
Early online date	5 Jan 2017
DOIs	https://doi.org/10.1007/s10854-016-6292-5
Publication status	Published - 1 Apr 2017

Access to Document

10.1007/s10854-016-6292-5

Cite this

@article{cc066b99767e4da0b73220b7a7c5dbc3,

title = "Investigation of moisture uptake into printed circuit board laminate and solder mask materials",

abstract = "Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.",

author = "H{\'e}l{\`e}ne Conseil-Gudla and Gudla, {Visweswara C.} and Shruti Borgaonkar and Jellesen, {Morten S.} and Rajan Ambat",

year = "2017",

month = apr,

day = "1",

doi = "10.1007/s10854-016-6292-5",

language = "English",

volume = "28",

pages = "6138--6151",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

publisher = "Springer Nature",

number = "8",

}

TY - JOUR

T1 - Investigation of moisture uptake into printed circuit board laminate and solder mask materials

AU - Conseil-Gudla, Hélène

AU - Gudla, Visweswara C.

AU - Borgaonkar, Shruti

AU - Jellesen, Morten S.

AU - Ambat, Rajan

PY - 2017/4/1

Y1 - 2017/4/1

N2 - Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.

AB - Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with the moisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and on increase of water uptake of the materials has been analysed.

UR - http://www.scopus.com/inward/record.url?scp=85008462624&partnerID=8YFLogxK

U2 - 10.1007/s10854-016-6292-5

DO - 10.1007/s10854-016-6292-5

M3 - Article

AN - SCOPUS:85008462624

SN - 0957-4522

VL - 28

SP - 6138

EP - 6151

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 8

ER -

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Abstract

Access to Document

Other files and links

Fingerprint

Cite this