Abstract
The miniaturization of technology increasingly requires the development of both new structures as well as novel techniques for their manufacture and modification. Semiconductor nanowires (NWs) are a prime example of this and as such have been the subject of intense scientific research for applications ranging from microelectronics to nano-electromechanical devices. Ion irradiation has long been a key processing step for semiconductors and the natural extension of this technique to the modification of semiconductor NWs has led to the discovery of ion-beam-induced deformation effects. In this work, transmission electron microscopy with in-situ ion bombardment has been used to directly observe the evolution of individual silicon and germanium NWs under irradiation. Silicon NWs were irradiated with either 6 keV neon ions or xenon ions at 5, 7 or 9.5 keV with a flux of 3×10<sup>13</sup> ions/cm<sup>2</sup>/s. Germanium NWs were irradiated with 30 or 70 keV xenon ions with a flux of 10<sup>13</sup> ions/cm<sup>2</sup>/s. These new results are combined with those reported in the literature in a systematic analysis using a custom implementation of the Transport of Ions in Matter Monte Carlo computer code to facilitate a direct comparison with experimental results taking into account the wide range of experimental conditions. Across the various studies this has revealed underlying trends and forms the basis of a critical review of the various mechanisms which have been proposed to explain the deformation of semiconductor NWs under ion irradiation.
Original language | English |
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Journal | Nanotechnology |
Volume | 29 |
Issue number | 33 |
Early online date | 21 May 2018 |
DOIs | |
Publication status | Published - 8 Jun 2018 |
Keywords
- in situ transmission electron microscopy
- ion irradiation-induced bending
- radiation damage
- semiconductor nanowires