Lift-off tolerant pancake eddy-current sensor for the thickness and spacing measurement of non-magnetic plates

Mingyang Lu*, Xiaobai Meng, Ruochen Huang, Liming Chen, Anthony Peyton, Wuliang Yin

*Corresponding author for this work

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Abstract

The lift-off spacing distance between the eddy current sensor and test piece will influence the detected signals and accuracy of the measurement. Various techniques including novel sensor designs, features (lift-off point of intersection, lift-off invariance phenomenon), and algorithms have been proposed for the compensation of error caused by the lift-off effect using the eddy current sensor. However, few of these have directly measured the lift-off spacing distance, particularly for the distance up to 15 mm. In this paper, a lift-off tolerant pancake sensor has been designed. By analysing the sensitive region of the magnetic vector potential change (due to the test piece), the receiver of the sensor is designed as a circular spiral pancake coil with a large mean radius and span length (the difference between inner and outer radius). Experiments on the inductance measurement of three different non-magnetic samples have been carried out using both the designed pancake sensor and the previous triple-helix sensor. From the experiment result, the detected signal of the designed sensor has been proved much larger than that of the triple-helix sensor. Besides, simplified algorithms have been proposed for the measurement of the lift-off spacing and thickness of non-magnetic samples when using the proposed pancake sensor. Results show that the lift-off spacing and thickness can be measured with a small error of 0.14 mm (absolute error under 209.66 kHz), and 1.35 % (relative error, under low working frequencies of 142, 238, and 338 Hz) for the lift-off spacing from 1 to 15 mm.
Original languageEnglish
Article number9237995
JournalIEEE Transactions on Instrumentation and Measurement
Volume70
Early online date23 Oct 2020
DOIs
Publication statusPublished - 31 Dec 2020

Keywords

  • Eddy current (EC)
  • lift-off tolerant
  • nondestructive testing
  • pancake sensor
  • thickness measurement

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  • Electromagnetic Sensing Group

    Peyton, A. (PI), Fletcher, A. (Researcher), Daniels, D. (CoI), Conniffe, D. (PGR student), Podd, F. (PI), Davidson, J. (Researcher), Anderson, J. (Support team), Wilson, J. (Researcher), Marsh, L. (PI), O'Toole, M. (PI), Watson, S. (PGR student), Yin, W. (PI), Regan, A. (PGR student), Williams, K. (Researcher), Rana, S. (Researcher), Khalil, K. (PGR student), Hills, D. (PGR student), Whyte, C. (PGR student), Wang, C. (PGR student), Hodgskin-Brown, R. (PGR student), Dadkhahtehrani, F. (PGR student), Forster, S. (PGR student), Zhu, F. (PGR student), Yu, K. (PGR student), Xiong, L. (PGR student), Lu, T. (PGR student), Zhang, L. (PGR student), Lyu, R. (PGR student), Zhu, R. (PGR student), She, S. (PGR student), Meng, T. (PGR student), Pang, X. (PGR student), Zheng, X. (PGR student), Bai, X. (PGR student), Zou, X. (PGR student), Ding, Y. (PGR student), Shao, Y. (PGR student), Xia, Z. (PGR student), Zhang, Z. (PGR student), Khangerey, R. (PGR student) & Lawless, B. (Researcher)

    1/10/04 → …

    Project: Research

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