Abstract
Work has been carried out recently, which demonstrates misorientation measurements recorded by using electron backscatter diffraction (EBSD) enables one to undertake local post mortem plastic strain quantification once the degree of misorientation is calibrated against plastic strain. The present paper builds on this work and investigates the possibility of determining strain in individual grains. Due to the anisotropy of crystalline grains, polycrystalline material deform inhomogeneously on a microstructural level. In this study, the local strain induced in a pure copper specimen during tensile loading measured using EBSD was compared to in-situ strain measurements using optical microscopy imaging in conjunction with image correlation technique. By applying an averaging procedure for improving the accuracy of the measured EBSD data, the distribution of the misorientation within grains was quantified, and, as one would expect, it tended to be highest near the grain boundaries.
Original language | English |
---|---|
Pages (from-to) | 173-179 |
Number of pages | 6 |
Journal | Applied Mechanics and Materials |
Volume | 7-8 |
Publication status | Published - 2007 |
Keywords
- Copper
- Electron backscatter diffraction
- Image correlation
- Local deformation
- Plastic strain