Abstract
RF on-wafer device measurements require the provision of probe contact pads and transmission line structures to feed the device ports. A lumped equivalent circuit of the feed structure as determined through the measurement of on-wafer dummy structures and electromagnetic simulation enables three-step device de-embedding to be performed by matrix conversion of the measured S-parameters. The technique is applied to measurements of a Filtronic 6×50 μm GaAs PHEMT to obtain pure device data for large-signal modelling. The drawbacks of using a lumped element technique for large device structures at high frequencies are highlighted.
Original language | English |
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Title of host publication | host publication |
Number of pages | 7 |
DOIs | |
Publication status | Published - 2002 |
Event | Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on - Duration: 1 Jan 1824 → … |
Conference
Conference | Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on |
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Period | 1/01/24 → … |