Lumped Equivalent Circuit De-embedding of GaAs Structures [PHEMT Example]

C Duff, R Sloan

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    RF on-wafer device measurements require the provision of probe contact pads and transmission line structures to feed the device ports. A lumped equivalent circuit of the feed structure as determined through the measurement of on-wafer dummy structures and electromagnetic simulation enables three-step device de-embedding to be performed by matrix conversion of the measured S-parameters. The technique is applied to measurements of a Filtronic 6×50 μm GaAs PHEMT to obtain pure device data for large-signal modelling. The drawbacks of using a lumped element technique for large device structures at high frequencies are highlighted.
    Original languageEnglish
    Title of host publicationhost publication
    Number of pages7
    DOIs
    Publication statusPublished - 2002
    EventElectron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on -
    Duration: 1 Jan 1824 → …

    Conference

    ConferenceElectron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
    Period1/01/24 → …

    Fingerprint

    Dive into the research topics of 'Lumped Equivalent Circuit De-embedding of GaAs Structures [PHEMT Example]'. Together they form a unique fingerprint.

    Cite this