| Original language | English |
|---|---|
| Publication status | Published - 2008 |
Megasonic Enhanced Wafer Bumping Process to Enable High Density Electronics Interconnection
- Y. Tian
- , J. Kaufmann
- , C. Liu
- , D. A. Hutt
- , B. Stevens
- , M. P. Y. Desmulliez
Research output: Other contribution