Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing.

Paul Sharratt

Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing.

Paul Sharratt (Other)

Research output: Patent

Abstract

The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures. [on SciFinder (R)]

Original language	English
Patent number	U.S. Pat. Appl. Publ.
Publication status	Published - 2003

Cite this

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title = "Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing.",

abstract = "The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures. [on SciFinder (R)]",

author = "Paul Sharratt",

year = "2003",

language = "English",

type = "Patent",

note = "U.S. Pat. Appl. Publ.",

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TY - PAT

T1 - Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing.

A2 - Sharratt, Paul

PY - 2003

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N2 - The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures. [on SciFinder (R)]

AB - The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures. [on SciFinder (R)]

M3 - Patent

M1 - U.S. Pat. Appl. Publ.

ER -

Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing.

Abstract

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