Microwave bonding of poly(methylmethacrylate) microfluidic devices using a conductive polymer

R. J. Holmes; C. McDonagh; J. A D McLaughlin; S. Mohr; N. J. Goddard; P. R. Fielden

doi:10.1016/j.jpcs.2011.02.005

Microwave bonding of poly(methylmethacrylate) microfluidic devices using a conductive polymer

R. J. Holmes, C. McDonagh, J. A D McLaughlin, S. Mohr, N. J. Goddard, P. R. Fielden

Research output: Contribution to journal › Article › peer-review

Abstract

Component binding within microfluidic devices is a problem that has long been seeking a solution. In this investigation, the use of microwave radiation to seal PMMA components has been investigated using polyaniline as an absorber that is capable of inducting interfacial bonding. Straight microchannels were machined into PMMA using a Datron CAT3DM6 CNC machine with widths and depths across a range of 1001000 μm. Prototype fluidic devices were prepared with channel patterns utilizing varying feature sizes, bends and flow profiling to demonstrate the application of the technique to real microfluidic devices. Experimental data illustrated the successful bonding of channels in the range stated previously and bonding (tensile) strength was assessed via pull tests on bonded PMMA using an Engstrom Zwick 100 tensile testing system (Engstrom Ltd, US). Coherent, defect free seals were attained with breakage tests requiring an excess of 1 kN force. © 2011 Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	626-629
Number of pages	3
Journal	Journal of Physics and Chemistry of Solids
Volume	72
Issue number	6
DOIs	https://doi.org/10.1016/j.jpcs.2011.02.005
Publication status	Published - Jun 2011

Keywords

Fabrication

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.jpcs.2011.02.005

http://www.sciencedirect.com/science/article/pii/S0022369711000291

Cite this

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title = "Microwave bonding of poly(methylmethacrylate) microfluidic devices using a conductive polymer",

abstract = "Component binding within microfluidic devices is a problem that has long been seeking a solution. In this investigation, the use of microwave radiation to seal PMMA components has been investigated using polyaniline as an absorber that is capable of inducting interfacial bonding. Straight microchannels were machined into PMMA using a Datron CAT3DM6 CNC machine with widths and depths across a range of 1001000 μm. Prototype fluidic devices were prepared with channel patterns utilizing varying feature sizes, bends and flow profiling to demonstrate the application of the technique to real microfluidic devices. Experimental data illustrated the successful bonding of channels in the range stated previously and bonding (tensile) strength was assessed via pull tests on bonded PMMA using an Engstrom Zwick 100 tensile testing system (Engstrom Ltd, US). Coherent, defect free seals were attained with breakage tests requiring an excess of 1 kN force. {\textcopyright} 2011 Elsevier Ltd. All rights reserved.",

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doi = "10.1016/j.jpcs.2011.02.005",

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journal = "Journal of Physics and Chemistry of Solids",

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AU - Holmes, R. J.

AU - McDonagh, C.

AU - McLaughlin, J. A D

AU - Mohr, S.

AU - Goddard, N. J.

AU - Fielden, P. R.

PY - 2011/6

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N2 - Component binding within microfluidic devices is a problem that has long been seeking a solution. In this investigation, the use of microwave radiation to seal PMMA components has been investigated using polyaniline as an absorber that is capable of inducting interfacial bonding. Straight microchannels were machined into PMMA using a Datron CAT3DM6 CNC machine with widths and depths across a range of 1001000 μm. Prototype fluidic devices were prepared with channel patterns utilizing varying feature sizes, bends and flow profiling to demonstrate the application of the technique to real microfluidic devices. Experimental data illustrated the successful bonding of channels in the range stated previously and bonding (tensile) strength was assessed via pull tests on bonded PMMA using an Engstrom Zwick 100 tensile testing system (Engstrom Ltd, US). Coherent, defect free seals were attained with breakage tests requiring an excess of 1 kN force. © 2011 Elsevier Ltd. All rights reserved.

AB - Component binding within microfluidic devices is a problem that has long been seeking a solution. In this investigation, the use of microwave radiation to seal PMMA components has been investigated using polyaniline as an absorber that is capable of inducting interfacial bonding. Straight microchannels were machined into PMMA using a Datron CAT3DM6 CNC machine with widths and depths across a range of 1001000 μm. Prototype fluidic devices were prepared with channel patterns utilizing varying feature sizes, bends and flow profiling to demonstrate the application of the technique to real microfluidic devices. Experimental data illustrated the successful bonding of channels in the range stated previously and bonding (tensile) strength was assessed via pull tests on bonded PMMA using an Engstrom Zwick 100 tensile testing system (Engstrom Ltd, US). Coherent, defect free seals were attained with breakage tests requiring an excess of 1 kN force. © 2011 Elsevier Ltd. All rights reserved.

KW - Fabrication

U2 - 10.1016/j.jpcs.2011.02.005

DO - 10.1016/j.jpcs.2011.02.005

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JO - Journal of Physics and Chemistry of Solids

JF - Journal of Physics and Chemistry of Solids

IS - 6

ER -

Microwave bonding of poly(methylmethacrylate) microfluidic devices using a conductive polymer

Abstract

Keywords

UN SDGs

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