Novel characterization techniques for interface related defects in semiconductor-insulator systems

B. Hamilton*, M. Ishii, A. R. Peaker

*Corresponding author for this work

    Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

    Abstract

    This paper describes new attempts to harness scanning probe microscopy methods to solve problems associated with the quantification of the non-uniform distribution of defects and interface states. This is specifically in relation to the use of thin dielectrics in ultra small device structures. In particular the combination of UV laser and soft x-ray (synchrotron radiation) pumped scanning probe experiments is described. For example, atomic force microscopy (AFM) used in the Kelvin probe mode can provide nm scale spatial resolution of surface or (more significantly) buried interface charge. The Kelvin probe provides a non-contact measure of the long-range electric fields due to fixed charge; such fields spread beyond the van der Walls' interaction.

    Original languageEnglish
    Title of host publicationProceedings - Electrochemical Society
    Pages47-58
    Number of pages12
    Publication statusPublished - 1 Jan 2005
    Event207th ECS Meeting - Quebec, Canada
    Duration: 16 May 200520 May 2005

    Conference

    Conference207th ECS Meeting
    Country/TerritoryCanada
    CityQuebec
    Period16/05/0520/05/05

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