Numerical simulation of heat and moisture transfer in porous walls with microencapsulated PCM

Y Li, X Wang, S Li, J L Niu, X Zeng, D Ruan, L Koehl

    Research output: Chapter in Book/Conference proceedingChapter

    Original languageEnglish
    Title of host publicationComputational Textile
    Pages255-263
    Number of pages9
    Publication statusPublished - 2007

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