Proceedings of 2007 Mediterranean Microwave Symposium, 14- 16 May 2007,

Ali Rezazadeh

    Research output: Chapter in Book/Conference proceedingConference contribution

    Abstract

    Newly developed broadband passive MMIC couplers using three-dimensional multilayer technology have been designed fabricated and characterised. The system of three layers of metals and two layers of sandwich polyimide as dielectrics was employed. On-wafer RF measurements were carried out on the fabricated directional couplers which shows good performances over 10 to 30 GHz.
    Original languageEnglish
    Title of host publicationhost publication
    Place of PublicationIEEE Xplore
    PublisherEuropean Microwave Association
    Number of pages4
    Publication statusPublished - 30 May 2007
    EventMediterian Microwave Conference - Budapest, Hungry
    Duration: 14 May 200716 May 2007

    Conference

    ConferenceMediterian Microwave Conference
    CityBudapest, Hungry
    Period14/05/0716/05/07

    Keywords

    • Multilayer
    • MMICs
    • passive MMICs
    • three-demensional multialyer

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