Abstract
Newly developed broadband passive MMIC couplers using three-dimensional multilayer technology have been designed fabricated and characterised. The system of three layers of metals and two layers of sandwich polyimide as dielectrics was employed. On-wafer RF measurements were carried out on the fabricated directional couplers which shows good performances over 10 to 30 GHz.
Original language | English |
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Title of host publication | host publication |
Place of Publication | IEEE Xplore |
Publisher | European Microwave Association |
Number of pages | 4 |
Publication status | Published - 30 May 2007 |
Event | Mediterian Microwave Conference - Budapest, Hungry Duration: 14 May 2007 → 16 May 2007 |
Conference
Conference | Mediterian Microwave Conference |
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City | Budapest, Hungry |
Period | 14/05/07 → 16/05/07 |
Keywords
- Multilayer
- MMICs
- passive MMICs
- three-demensional multialyer