TY - JOUR
T1 - Quantitative microstructure characterization of self-annealed copper films with electron backscatter diffraction
AU - Pantleon, Karen
AU - Gholinia, Ali
AU - Marcel Somers, A. J.
PY - 2008/2/7
Y1 - 2008/2/7
N2 - Electron backscatter diffraction (EBSD) was applied to analyze cross sections of self-annealed copper electrodeposits, for which earlier the kinetics of self-annealing had been investigated by in-situ X-ray diffraction (XRD). The EBSD investigations on the grain size, grain boundary character and crystallographic texture of copper films with different thicknesses essentially supplement results from in-situ XRD. Twin relations between neighboring grains were identified from the orientation maps and the observed twin chains confirm multiple twinning in copper electrodeposits as the mechanism of microstructure evolution at room temperature (self-annealing).
AB - Electron backscatter diffraction (EBSD) was applied to analyze cross sections of self-annealed copper electrodeposits, for which earlier the kinetics of self-annealing had been investigated by in-situ X-ray diffraction (XRD). The EBSD investigations on the grain size, grain boundary character and crystallographic texture of copper films with different thicknesses essentially supplement results from in-situ XRD. Twin relations between neighboring grains were identified from the orientation maps and the observed twin chains confirm multiple twinning in copper electrodeposits as the mechanism of microstructure evolution at room temperature (self-annealing).
UR - http://www.scopus.com/inward/record.url?scp=54949111783&partnerID=8YFLogxK
U2 - 10.1002/pssa.200723292
DO - 10.1002/pssa.200723292
M3 - Article
AN - SCOPUS:54949111783
SN - 1862-6300
VL - 205
SP - 275
EP - 281
JO - Physica Status Solidi (A) Applications and Materials Science
JF - Physica Status Solidi (A) Applications and Materials Science
IS - 2
ER -