TY - JOUR
T1 - Quasi-distributed Temperature Detection of Press Pack IGBT Power Module Using FBG Sensing
AU - Durovic, Sinisa
AU - Barnes, Mike
AU - Li, Ran
AU - Mawby, Philip
AU - Ren, Hai
AU - Liu, Xianming
AU - Liu, Li
AU - Jiang, Huaping
PY - 2021/8/31
Y1 - 2021/8/31
N2 - In-situ temperature near the chips in a multiple-chip power semiconductor module is important information for thermal design validation, condition monitoring and overheat protection. Due to the compact packaging structure and clamping force, online detection of the temperature is challenging for a press pack module. This study attempts to achieve measurement by integrating optical Fiber Bragg Grating (FBG) sensors into the device. Different integration schemes are examined using experiments and theoretical analysis to show the effects on the transient performance. It is shown that FBG sensors with plate housing can effectively indicate the transient temperature ripple in normal converter operation, owing to the fast dynamic response of a small size sensor. The package integration has only minimal effects on the original distributions of electrical, thermal and mechanical quantities within the power module.
AB - In-situ temperature near the chips in a multiple-chip power semiconductor module is important information for thermal design validation, condition monitoring and overheat protection. Due to the compact packaging structure and clamping force, online detection of the temperature is challenging for a press pack module. This study attempts to achieve measurement by integrating optical Fiber Bragg Grating (FBG) sensors into the device. Different integration schemes are examined using experiments and theoretical analysis to show the effects on the transient performance. It is shown that FBG sensors with plate housing can effectively indicate the transient temperature ripple in normal converter operation, owing to the fast dynamic response of a small size sensor. The package integration has only minimal effects on the original distributions of electrical, thermal and mechanical quantities within the power module.
KW - Temperature measurement , Temperature sensors , Sensors , Presses , Semiconductor device measurement , Insulated gate bipolar transistors , Optical fiber sensors
UR - https://www.scopus.com/pages/publications/85136753317
U2 - 10.1109/JESTPE.2021.3109395
DO - 10.1109/JESTPE.2021.3109395
M3 - Article
SN - 2168-6777
JO - IEEE Journal of Emerging and Selected Topics in Power Electronics
JF - IEEE Journal of Emerging and Selected Topics in Power Electronics
ER -